Micro/Nano-Machining Research and Education Center, Tohoku University

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Facilities1F Cleanroom

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1F Cleanroom

You can check the corresponding device by clicking the number in the image.

1F Cleanroom
1 EVG mask aligner 2 EVG megasonic cleaner 3 EVG plasma activator 4 Fume hood 5 Two-fluid cleaner 6 Spin coater, Oven 7 Laser lithography system #1 8 Mask aligner (SUSS) #1 9 Mask aligner (SUSS) #2 10 HMDS treatment system 11 Spin coater 12 High-temp Oven 13 Mist coater 1 Fume hood 1 Fume hood 2 Thermal oxidation furnace 3 UV exposure 4 Four-probe resistivity measurement system 5 ICP-RIE #3 6 Asher for general use 7 Plasma/ozone TEOS CVD 8 Plasma-enhanced TEOS CVD 9 ICP-RIE #1 10 Ellipsometer 11 Plasma-enhanced SiN CVD 12 SiN etcher 13 SiCN Cat-CVD 14 CCP-RIE #3 15 CCP-RIE #2 16 Dual frequency RIE 17 EVG wafer bonder 18 Supercritical CO2 drier 19 ICP-RIE #2 20 CCP-RIE #1 21 FAB 22 Ion beam milling 23 Stylus profilometer 24 Ion implantation 1 Electron beam lithography 1 High-temp RF magnetron sputter 2 4 sources sputter 3 RF magnetron Sputter (ANELVA #2) 4 Facing target RF sputter 5 EB evaporator 6 ECR ion beam sputter 7 RF magnetron sputter (ANELVA) 8 Facing target DC sputter 9 Wafer bonder (Technofine) 10 RF magnetron sputter (Shibaura) #2 11 ECR sputter 12 RF magnetron sputter (Shibaura) #1 13 Fume hood
1F Cleanroom

Yellow room

Main cleanroom

Dark room

Metal deposition room