Micro/Nano-Machining Research and Education Center, Tohoku University

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Facilities1F Cleanroom

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1F Cleanroom

You can check the corresponding device by clicking the number in the image.

1F Cleanroom
1 EVG mask aligner 2 EVG megasonic cleaner 3 EVG plasma activator 4 Fume hood 5 Two-fluid cleaner 6 Spin coater, Oven 7 Laser lithography system #1 8 Mask aligner (SUSS) #1 9 Mask aligner (SUSS) #2 10 HMDS treatment system 11 Spin coater 12 High-temp Oven 13 Mist coater 1 Fume hood 1 Fume hood 2 H2 anneal furnace 3 Thermal oxidation furnace 4 LP-CVD 5 Stylus profilometer 6 UV exposure 7 Four-probe resistivity measurement system 8 RTA #1 9 ICP-RIE #3 10 Plasma/ozone TEOS CVD 11 Plasma-enhanced TEOS CVD 12 ICP-RIE #1 13 Ellipsometer 14 Plasma-enhanced SiN CVD 15 O2 asher 16 SiN etcher 17 SiCN Cat-CVD 18 CCP-RIE #3 19 CCP-RIE #2 20 Dual frequency RIE 21 EVG wafer bonder 22 Supercritical CO2 drier 23 ICP-RIE #2 24 Magnetic ICP-RIE 25 CCP-RIE #1 26 FAB 27 Ion beam milling 28 Ion implantation 29 UHV-CVD 30 Asher for general use 1 FE-SEM 2 Electron beam lithography 1 High-temp RF magnetron sputter 3 RF magnetron sputter (ULVAC) 4 Facing target RF sputter 5 EB evaporator 6 ECR ion beam sputter 7 RF magnetron sputter (ANELVA) 8 Facing target DC sputter 9 Wafer bonder (Technofine) 10 RF magnetron sputter (Shibaura) #2 11 ECR sputter 12 RF magnetron sputter (Shibaura) #1 13 Fume hood 14 Lamp annealing furnace
1F Cleanroom

Yellow room

Main cleanroom

Dark room

Metal deposition room