Tohoku University
- table of contents
1F Cleanroom
You can check the corresponding device by clicking the number in the image.
Yellow room
- 1 EVG mask aligner
- 2 Megasonic Cleaner
- 3 EVG Plasma Activator
- 4 Fume hood
- 5 Two-fluid cleaner
- 6 Spin Coater、Oven
- 7 Laser Lithography System #1
- 8 Mask aligner#1(SUSS, MA6/BA6)
- 9 Mask aligner (SUSS) #2
- 10 HDMS treatment system
- 11 Spin Coater
- 13 Spray coater
- 14 Mask aligner#3(SUSS, MA8/BA8)
Main cleanroom
- 1 Fume hood
- 2 Thermal oxidation furnace
- 3 UV exposure
- 4 4-probe resistivity meter
- 5 ICP-RIE#3(Pegasus, MPX)
- 6 Asher for general use
- 7 Plasma/ozone TEOS CVD
- 8 Plasme TEOS CVD
- 9 ICP-RIE#1(MUC21)
- 10 Ellipsometer(UVISEL)
- 11 Plasma-enhanced SiN CVD
- 12 SiN etcher
- 13 SiCN Cat-CVD
- 14 CCP-RIE #3
- 15 CCP-RIE #2
- 16 Dual frequency RIE
- 17 EVG wafer bonder（EV520)
- 18 Supercritical CO2 drier
- 19 ICP-RIE#2(MUC-21)
- 20 CCP-RIE #1
- 21 FAB
- 22 Ion beam milling
- 23 Surface profilometer
- 24 Ion implantation
- 25 Wafer Bonder (EVG540)
- 26 Wafer Aligner (EVG SmartView NT)
- 27 Plasma cleaner (AQ-500T)
- 28 Plasma cleaner (ONTOS)
- 29 Flip chip bonder(FC3000W)
- 30 Excimer exposure
- 31 Lift-off EQP(LOB8)
- 32 Anodic bonding
Dark room
Metal deposition room
- 1 High-temp RF magnetron sputter(SSP3000)
- 2 DC sputter
- 3 RF magnetron sputter(ANELVA#2,SPC-350UHV)
- 4 Facing target RF sputter
- 5 EB evaporation
- 6 ECR ion beam sputter（EIS-220）
- 7 RF magnetron sputter(ANELVA#1,SPC-350)
- 8 Facing target DC sputter
- 9 Wafer bonder (Technofine)
- 10 RF magnetron sputter(Shibaura#2,CFS-4ES)
- 11 ECR sputter
- 12 RF magnetron sputter(Shibaura#1,CFS-4ES)
- 13 Fume hood
- 14 AlN Sputtering#1