Micro/Nano-Machining Research and Education Center, Tohoku University

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Facilities3F

table of contents

3F

You can check the corresponding device by clicking the number in the image.

3F
Electrical measurement devices 1 Grinding machine(NVG-200A) 2 Polishing machine(1PM52) 3 Flip chip bonder #1 4 Bonding tester 6 Laser dicer 7 IR inspection camera 8 Tension and compression fatigue tester 9 Contact angle meter(DMe201) 10 Microscope(KH-7700) 11 Table top SEM(JCM-500) 12 Gas Chromatograph#1(GC-14B) 13 Gas Chromatograph#2(GC-2014AF) 14 Vibration Testing Machine(SW2015) 15 Double-Scan High Accuracy Laser Profiler(LT-9500) 16 Laser Displacement Sensor#1(LK-G5000V) 17 Laser Displacement Sensor#2(LK-G5000) 18 Network Analyzer(E5071C) 19 3D printer(X-Max 3D) 1 Drill press 2 Circuit board plotter 3 Lathe 4 Milling machine 5 3D Milling Machine(MDX-50) 6 3D Milling Machine(MDX-20)
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