Micro/Nano-Machining Research and Education Center, Tohoku University

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FacilitiesSurface treatment

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Surface treatment

UV exposure

UV exposure
Manufacturer name (model)Samco (UV-T)
UseRemoval of organic substances by UV + O3, UV cure by UV + N2
Main specificationsLight source: low pressure mercury lamp (253.7, 184.9 nm), Stage temperature setting range: Room temperature to 300 ℃
Process gasO3, O2, N2
Sample sizeMaximum ⌀200 mm, thickness 2 mm or less
Remarks

Two-fluid cleaner

Two-fluid cleaner
Manufacturer name (model)Actes (ADE-3000S)
UseTwo-fluid spray cleaning device using water or organic solvent (IPA, etc.)
Main specificationsWafer rotation speed: 0 to 3000 rpm, wafer swing angle: 0 to 40°
Sample size□20 mm or 4 inch
Remarks

HMDS treatment system

HMDS treatment system
Manufacturer name (model)Self-made
UseApply resist such as OFPR to the surface of the silicon wafer In some cases, surface treatment is more appropriate than OAP dripping. Since the series of treatments after washing with sulfuric acid hydrogen peroxide can be handled without touching the atmosphere, the possibility of resist coating failure is reduced.
Sample size□20 mm–4 inch
Remarks

Supercritical CO2 drier

Supercritical CO2 drier
Manufacturer name (model)SC Fluids (CPD1100)
ApplicationDrying of MEMS device using supercritical
Sample sizeMaximum 4 inch
Remarks