Micro/Nano-Machining Research and Education Center, Tohoku University

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Facilities2F

table of contents

2F

You can check the corresponding device by clicking the number in the image.

2F
0 Laser doppler vibrometer 1 UV exposure 2 Parylene evaporator 3 Flip chip bonder #2 4 Wire bonder #1 5 Dicer 6 Fume hood 7 Spin coater 8 Fume hood 9 Electroplating #1, #2 2 Wafer bonding inspector 3 Tension and compression fatigue tester 4 Isotropic Si etcher 5 Thermal Decomposition Spectroscopy, TDS 6 PZT sputter 7 Plasma diamond CVD 8 ALD 9 14GHz network analyzer 1 High resolution SEM 2 FIB 3 Ultraviolet spectroscopic ellipsometer 4 Ion coater 5 Polishing SEM sample maker 6 Ion milling SEM sample maker 7 UV/Vis/IR spectrometer 8 TG/DTA 9 XRD(D8 ADVANCE) 10 Microsystem analyzer (MSA-500) 11 Microsystem analyzer (MSA-400) 12 High-frequency laser doppler vibrometer 13 Thin film characterization system 14 FT-IR 1 YAG laser 2 VIM, Fluorescence microscope 3 Fume hood 4 PLD 5 Hall effect measurement system 6 MBE
2F

Assembly test room

Optical measurement room

Analysis room

Laser fabrication room