Micro/Nano-Machining Research and Education Center, Tohoku University
- table of contents
Mechanical measurement
Thin film characterization system
| Manufacturer name (model) | NEC Sanei (MH4000) |
| Application | Measures hardness, adhesive force, young rate, and internal stress. |
| Sample size | Maximum □20 mm (Depends on the measurement content.)
|
| Application example | Hardness measurement of thin film. |
| Main specifications | Load range: 0.98 μN–98 mN, Pushing depth measurement range: 0–5 μm
|
| Remarks | |
High-frequency laser doppler vibrometer
| Manufacturer name (model) | Polytech (UHF-120)
|
| Use | Several 100 MHz-plane vibration measurement |
| Sample size | 4 inch (preferably about □20 mm)
|
| Application example | Measurement of surface acoustic waves excited by SAW elements.
|
| Main specifications | Measurement range: 2–1200 MHz (preferably 50–800 MHz), Planar resolution: 1 μm
|
| Others | Wear safety glasses when using laser (532 nm, 5 mW, Class 3R) |
| Remarks | |
Microsystem analyzer
| Manufacturer name (model) | Polytec (MSA-400, MSA-500) |
| Application | In-plane vibration measurement, out-of-plane vibration measurement, surface shape measurement
|
| Sample size | By objective lens.
|
| Application example | Resonance frequency measurement of out-of-plane vibration, vibration observation of in-plane vibration, surface shape observation |
| Main specifications | Laser Doppler vibrometer, stroboscope video microscope, white light interference meter
|
| Remarks | |
Micro vibration measurement system
| ManufacturerName (model) | Neoarc (MLD-350) |
| Application | Simultaneous out-of-plane vibration measurement at two points, maximum 1.5 MHz
|
| Sample size | Maximum 20 mm (depending on objective angle and objective lens) |
| Application example | Out-of-plane vibration 2 Difference measurement in point simultaneous measurement |
| Main specifications | Laser Doppler vibrometer
|
| Remarks | |
Laser doppler vibrometer
| Manufacturer name (model) | Neoarc (MLD-102-IZ) |
| Use | Micro-vibration measurement device by optical heterodyne method. Out-of-plane and in-plane measurement is possible.
|
| Sample size | Stage size 100 mm square
|
| Application example | Vibration measurement of mechanical oscillator |
| Main specifications | Laser light source: He-Ne laser, response frequency: DC-100 kHz (vertical and horizontal), minimum resolution: 0.01 μm (vertical) / 0.04 μm (horizontal)
|
| Remarks | |
Tension and compression fatigue tester
| Manufacturer name (model) | Zwick (Zwickline Z0.5TN)
|
| Application (features) | Compressive tensile test
|
| Sample size | Maximum 85 × 50 mm
|
| Application example | Acquisition of stress strain curve. |
| Main specifications | Maximum load: 500 N, Speed: 0.5 μm/min–2000 mm/min, Resolution: 0.083 μm, Position accuracy: ± 2 μm, Measurement accuracy: 2 N |
| Remarks | |
Bonding force measurement system
| Manufacturer name(Model) | RHESCA (PTR-1101) |
| Application | For evaluation of bonding force failure of wafer bonding
|
| Sample size | The bonding area is preferably 5 mm2 or less (maximum share weight 100 kg)
|
| Application example | Bonding area 1 mm2 of Au-Au thermocompression bonding joint and Si-Si direct joint in.
|
| Main specifications | Sensor weight range: Share: 100 gf–100 kgf, Pull push: 20 gf–20 kgf
|
| Remarks | |
Tohoku University
