Micro/Nano-Machining Research and Education Center, Tohoku University
- table of contents
Mechanical measurement
Thin film characterization system
| Manufacturer name (model) | Elionix (ENT-5) |
| Purpose | Measurement of hardness, elastic modulus, and other properties of thin films, extreme surfaces, and micro-regions |
| Sample size | φ50 × t3.5mm or smaller |
| Application example | Hardness measurement of thin films |
| Main Specifications | High-load unit: 5µN – 2N, Low-load unit: 0.5µN – 10mN, Indenter: Berkovich(α =65.03°) |
| Remarks | |
High-frequency laser doppler vibrometer
| Manufacturer name (model) | Polytech (UHF-120)
|
| Use | Several 100 MHz-plane vibration measurement |
| Sample size | 4 inch (preferably about □20 mm)
|
| Application example | Measurement of surface acoustic waves excited by SAW elements.
|
| Main specifications | Measurement range: 2–1200 MHz (preferably 50–800 MHz), Planar resolution: 1 μm
|
| Others | Wear safety glasses when using laser (532 nm, 5 mW, Class 3R) |
| Remarks | |
Microsystem Analyzer(MSA-500,MSA-400)
| Manufacturer name (model) | Polytec (MSA-400, MSA-500) |
| Application | In-plane vibration measurement, out-of-plane vibration measurement, surface shape measurement
|
| Sample size | By objective lens.
|
| Application example | Resonance frequency measurement of out-of-plane vibration, vibration observation of in-plane vibration, surface shape observation |
| Main specifications | Laser Doppler vibrometer, stroboscope video microscope, white light interference meter
|
| Remarks | |
Micro vibration measurement system
| ManufacturerName (model) | Neoarc (MLD-350) |
| Application | Simultaneous out-of-plane vibration measurement at two points, maximum 1.5 MHz
|
| Sample size | Maximum 20 mm (depending on objective angle and objective lens) |
| Application example | Out-of-plane vibration 2 Difference measurement in point simultaneous measurement |
| Main specifications | Laser Doppler vibrometer
|
| Remarks | |
Tension and compression fatigue tester
| Manufacturer name (model) | Zwick (Zwickline Z0.5TN)
|
| Application (features) | Compressive tensile test
|
| Sample size | Maximum 85 × 50 mm
|
| Application example | Acquisition of stress strain curve. |
| Main specifications | Maximum load: 500 N, Speed: 0.5 μm/min–2000 mm/min, Resolution: 0.083 μm, Position accuracy: ± 2 μm, Measurement accuracy: 2 N |
| Remarks | |
Bonding tester
| Manufacturer name(Model) | RHESCA (PTR-1101) |
| Application | For evaluation of bonding force failure of wafer bonding
|
| Sample size | The bonding area is preferably 5 mm2 or less (maximum share weight 100 kg)
|
| Application example | Bonding area 1 mm2 of Au-Au thermocompression bonding joint and Si-Si direct joint in.
|
| Main specifications | Sensor weight range: Share: 100 gf–100 kgf, Pull push: 20 gf–20 kgf
|
| Remarks | |
Vibration Testing Machine(SW2015)
| Manufacturer name(Model) | ASAHI SEISAKUSYO – SW2015 |
| Application | Generate vibartion (Sine wave, random wave) |
| Main specifications | 5 – 20kHz |
| Sample size | < 1 Kg |
| Others | Energy harvester test |
| Remarks | |
Double-Scan High Accuracy Laser Profiler(LT-9500)
| Manufacturer name(Model) | Keyence LT-9500 LT-9010 |
| Application | Wafer warpage measurement |
| Main specifications | < 300 µm warpage |
| Sample size | 4 inch |
| Others | Residue stress measurement |
| Remarks | |
Laser Displacement Sensor#1(LK-G5000V)
| Manufacturer name(Model) | Keyence_LK-G5000V |
| Application | Vibration Energy harvesters evaluation |
| Main specifications | Vibration range: 1nm – 1mm |
| Others | Output power measurement, vibration displacement measurement |
| Remarks | |
Laser Displacement Sensor#2(LK-G5000)
| Manufacturer name(Model) | Keyence_LK-G5000 |
| Application | Vibration Energy harvesters evaluation |
| Main specifications | Vibration range: 1nm – 1mm |
| Others | Output power measurement, vibration displacement measurement |
| Remarks | |
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