Micro/Nano-Machining Research and Education Center, Tohoku University

HOMEFacilities3F

Facilities3F

table of contents

3F

You can check the corresponding device by clicking the number in the image.

3F
1 Grinding machine 2 Polishing machine 3 FT-IR 4 Flip chip bonder #1 5 Microsystem analyzer (MSA-500) 6 UV/Vis/IR spectrometer 7 High-frequency laser doppler vibrometer 8 Bonding force measurement system 9 Laser dicer 10 Impedance/material analyzer 11 Microsystem analyzer (MSA-400) 12 Wire bonder #2 1 Drill press 2 Circuit board plotter 3 Lathe 4 Milling machine
3F

3F experiment room

Electrical experiment room