Tohoku University and Tsinghua University have contributed funds to support research and exchange activities jointly conducted by researchers at both universities since 2019.
If you wish to apply for this third round of funding, submit an application form by February 22, 2023 after consultation with appropriate colleagues at Tsinghua University.
Online Application Period:
From December 16, 2022 (Fri) to February 22, 2023 (Wed)
Research Areas:
Applications from all fields are welcome. Priority will be given to proposals from the following fields: Materials Science, Spintronics, and Disaster Science
Funding Period:
From April 1, 2023 (Sat) to March 31, 2025 (Mon)
※However, due to both universities’ financial years being different, the funding periods at each university will differ.
Application Guidelines and Application Form:
Application Guidelines (PDF)
Application Form (WORD)
Please submit all applications to the Tohoku University Global Engagement Division at the email address below.
Contact:
Tohoku University Global Engagement Division
Tel: +81 22 217-5578
Email：kokusai-k@grp.tohoku.ac.jp