Tohoku University and Nanyang Technological University in Singapore have set up a joint seed fund to encourage collaborative research. Based on an agreement made in September 2025, both universities are now inviting the first round’s applications from researchers who would like to promote joint research projects with Nanyang Technological University researchers in the 2026 academic year.
To apply, submit an application form by October 17, 2025, after reviewing the Application Guidelines and consulting with the appropriate colleagues at Nanyang Technological University.
Application Period:
From September 12 (Fri), 2025 to October 17 (Fri), 2025
Research Areas:
All fields.
※Priority will be given to proposals from the following fields: Electrical and Electronic Engineering, Mechanical and Aerospace Engineering, Life Sciences and Energy, Environmental Resources and Recycling.
Funding Period:
From December 30, 2025 (Tue) to December 29, 2026 (Tue)
Application Guidelines and Application Form:
◇Guidelines: Nanyang Technological University – Tohoku Joint Seed Fund Guidelines_Final
◇Application Form: Nanyang Technological University -Tohoku Joint Seed Fund_2025 Application Form
For Tohoku University PIs, please submit all applications to the Tohoku University Research Promotion Section at the email address below.
Contact:
Tohoku University Research Promotion Section, Research Promotion Division, Research Promotion Department
E-mail: kenkyo-kikaku*grp.tohoku.ac.jp (Replace * with @.)