Seminar on Dicing by DISCO Corporation (June 5, 2024)

We are pleased to invite an engineer from DISCO Corporation to MNC to give a seminar on “Dicer Basics”.
We hope that all interested persons, regardless of whether or not they have used a dicer before, and regardless of whether they are faculty members or students, will attend this seminar.

This is a valuable opportunity for you to directly ask questions about the basics of dicers and your daily questions to the technicians.
No advance notice is required, so please come to the seminar venue on the day of the seminar.
We look forward to your participation.

Speakers:
DISCO Corporation
　MPS Team, Product Support Group, Precision Diamond Technology Department, Technology Development Division
　Tetsuya Sakanishi
Product Support Group PA Team, Precision Diamond Technology Department, Technology Development Division, DISCO Corporation
　Precision Diamond Technology Department, Technology Development Division, DISCO Corporation
　Masahiro Kobayashi

Lecture Title:
Company profile of DISCO Corporation
About cutting process (dicing) and blades
Elements of blades
About Dressing
DISCO blade lineup
Introduction of the latest blades

Location:
MNC 3rd floor, Seminar Room

Date & Time:
Wednesday, June 5, 2:00 p.m. – (about 60 minutes including Q&A)