2023

1. Nanoindentation Study of Human Fingernail for Determining its Structural Elasticity

   H. Tohmyoh, M. Abukawa

   Skin Research and Technology, 29 (2023), e13456, 6 pages. [Link]

2. Resistive Ion Sensors Based on Metal–Oxide–Semiconductor Nanostructures Formed by Heating Metal Foil

   Y. Kimura, H. Tohmyoh

   IEEE Sensors Letters, 7 (2023), 2001404, 4 pages. [Link]

3. Experimental and Numerical Investigation of the Relationship between Material Defects and Elastoplasticity Behavior of 3D-Printed Carbon-Fiber-Reinforced Thermoplastics under Compressive Loading

   Y. Hoshikawa, K. Shirasu, R. Higuchi, Y. Kawagoe, H. Tohmyoh, T. Okabe

   Composites Science and Technology, 241 (2023), 110116, 9 pages. [Link]

4. Fabrication of Cu Oxide/TiO₂ p–n Nanojunctions by Stress-Induced Migration

   Y. Kimura, H. Tohmyoh

   Journal of Applied Physics, 133 (2023), 114302, 7 pages. [Link]

5. Evaluation of Quality of Thick Photoresist Film by Acoustic Resonant Imaging Technique

   H. Kim, H. Tohmyoh

   Journal of Vacuum Science and Technology B, 41 (2023), 022601, 8 pages. [Link]

6. Relationship between the Length of Panel Side and the Deflection of Sandwich Panels with Corrugated Core

   A. Goto, H. Tohmyoh

   Transactions of the JSME, 89 (2023), 22-00282, 11 pages, in Japanese. [Link]

7. Grain Growth of Cu Wires during Joule Heat Welding

   H. Tohmyoh, T. Sakatoku

   Journal of Vacuum Science & Technology B, 41 (2023), 012206, 6 pages. [Link]