2005年

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1. Nondestructive Sizing of a 3D Surface Crack Generated in a Railway Component Using Closely Coupled Probes for Direct-Current Potential Drop Technique [Eng. Fract. Mech., 72 (2), (2005), 319 - 334]
   M. Akama and M. Saka
   
   
2. A Comparative Study of the Mechanical Strength of Chemical Vapor-Deposited Diamond and Physical Vapor-Deposited Hard Coatings [Thin Solid Films, 473 (1), (2005), 123 - 131]
   S. Kamiya, H. Nagasawa, K. Yamanobe and M. Saka
   
   
3. Microwave NDE of a Small 3-D Crack on the Surface of Stainless Steel [Proc. 11th Int. Conf. Fracture, March 20-25, 2005, Turin, Italy, (2005), CD-ROM]
   Y. Ju, M. Saka and Y. Uchimura
   
   
4. Derivation of Film Characteristic Constants by Using Governing Parameter for Electromigration Damage in Passivated Bambooline [Proc. 11th Int. Conf. Fracture, March 20-25, 2005, Turin, Italy, (2005), CD-ROM]
   M. Hasegawa, K. Sasagawa and M. Saka
   
   
5. High-Resolution Acoustic Imaging via the Dry-Coupling Interface without Including Nano-Meter Size Air Gaps [Proc. Third US-Japan Symp. Advancing Applications and Capabilities in NDE, June 20-24, 2005, Hawaii, USA, (2005), CD-ROM]
   H. Tohmyoh, M. Saka and H. Sakai
   
   
6. Effect of the Inner Hardness Distribution on NDE of Case Depth by Means of Four-Point Probes Method [Proc. Third US-Japan Symp. Advancing Applications and Capabilities in NDE, June 20-24, 2005, Hawaii, USA, (2005), CD-ROM]
   F. Takeo, Y. Aonahata and M. Saka
   
   
7. Acoustic Microscopy for Micro Electrical Interconnections [Proc. ASME InterPACK '05, July 17-22, 2005, San Francisco, California, USA, (2005), CD-ROM (IPACK2005-73061) ]
   H. Tohmyoh, T. Akaogi and M. Saka
   
   
8. Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines [Proc. ASME InterPACK '05, July 17-22, 2005, San Francisco, California, USA, (2005), CD-ROM (IPACK2005-73133) ]
   K. Sasagawa, S. Uno, N. Yamaji and M. Saka
   
   
9. Development of a New Microscopic Four-Point AFM Probe for the Measurement of Local Electrical Conductivity [Proc. ASME InterPACK '05, July 17-22, 2005, San Francisco, California, USA, (2005), CD-ROM (IPACK2005-73433) ]
   B.-F. Ju, Y. Ju and M. Saka
   
   
10. Microscopic Four-Point Atomic Force Microscope Probe Technique for Local Electrical Conductivity Measurement [Rev. Sci. Instrum., 76 (8), (2005), online]
    Y. Ju, B.-F. Ju and M. Saka
    
    
11. Evaluation of the Shape and Size of 3D Cracks Using Microwaves [NDT & E International, 38 (8), (2005), 726 - 731]
    Y. Ju, M. Saka and Y. Uchimura
    
    
12. Contactless Measurement of Electrical Conductivity of Si Wafers Independent of Wafer Thickness [Appl. Phys. Lett., 87 (16), (2005), 162102-1 - 162102-3]
    Y. Ju, Y. Hirosawa, H. Soyama and M. Saka
    
    
13. Formation of Metallic Nanowires by Utilizing Electromigration [J. Mater. Res., 20 (10), (2005), 2712 - 2718]
    M. Saka and R. Ueda
    
    
14. Development of Crack Depth Indicator for Deep Surface Crack [Proc. 2005 ASME Int. Mechanical Engineering Congress and Exposition, November 5-11, 2005, (2005), CD-ROM (IMECE2005-79867)]
    M. Hayakawa, S. Hamada, F. Takeo and M. Saka
    
    
15. DC Potential Drop Technique Selecting Probes Distances Properly for Sizing Deep Surface Cracks [Proc. 2005 ASME Int. Mechanical Engineering Congress and Exposition, November 5-11, 2005, (2005), CD-ROM (IMECE2005-79877)]
    F. Takeo, M. Saka, S. Hamada and M. Hayakawa
    
    
16. Verification of Prediction Method for Electromigration Failure Using Angled Polycrystalline Line [Key Eng. Mat., Vols.297-300, (2005), 263 - 268]
    S. Uno, M. Hasegawa, K. Sasagawa and M. Saka
    
    
17. Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-free Solders [Key Eng. Mat., Vols.297-300, (2005), 837 - 843]
    T. Hasegawa and M. Saka
    
    
18. A Methodology for Damage Strength Evaluation of a Single Biomimetic Microcapsule [Key Eng. Mat., Vols.297-300, (2005), 1730 - 1735]
    B.-F. Ju, Y. Ju and M. Saka
    
    

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