2003年

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1. Derivation of Film Characteristics and Prediction of Electromigration Failure in Passivated Polycrystalline Line [Advances Metallization Conference 2002, MRS, (2003), 291 - 296]
   K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
   
   
2. Recrystallization-Etch Observation of Plastic Deformation Caused by Cavitation Shotless Peening [J. Mater. Sci. Lett., 22 (2), (2003), 115 - 117]
   D. O. Macodiyo, H. Soyama and M. Saka
   
   
3. Development of a Millimeter Wave Compact Equipment for NDT of Materials [Int. J. Infrared and Millimeter Waves, 24 (3), (2003), 391 - 397]
   Y. Ju, Y. Hirosawa, M. Saka and H. Abé
   
   
4. Microwave Measurement of the Conductivity of Conducting Thin Films [Optics and Precision Engineering, 11 (1), (2003), 59 - 61]
   Y. Ju, Y. Hirosawa and M. Saka
   
   
5. 表層欠陥検出用超音波センサによる薄鋼板中の介在物検出 [非破壊検査, 52 (6), (2003), 297 - 302]
   山本 弘，瀧下芳彦，坂 真澄
   
   
6. Dry-Contact Technique for High-Resolution Ultrasonic Imaging [IEEE Trans. Ultrasonics, Ferroelectrics, and Frequency Control, 50 (6), (2003), 661 - 667]
   H. Tohmyoh and M. Saka
   
   
7. Cavitation Shotless Peening for Surface Modification of Alloy Tool Steel [JSME Int. J. (A), 46 (3), (2003), 398 - 402]
   H. Soyama, K. Sasaki, D. O. Macodiyo and M. Saka
   
   
8. Contactless Measurement of Thin Film Conductivity by a Microwave Compact Equipment [Int. J. Mod. Phys. B, 17 (8/9), (2003), 1904 - 1909]
   Y. Ju, Y. Hirosawa, M. Saka and H. Abé
   
   
9. Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends [Proc. IPACK03, Int. Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA (CD-ROM)]
   M. Hasegawa, K. Sasagawa, M. Saka and H. Abé
   
   
10. Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness [Proc. Int. Electronic Packaging Technical Conference and Exhibition (IPACK'03), July 6-11, 2003, Maui, Hawaii, USA (CD-ROM)]
    K. Sasagawa, M. Hasegawa, N. Yoshida, M. Saka and H. Abé
    
    
11. Microwave Imaging of Conductivity Distribution of Silicon Wafers [Proc. Int. Electronic Packaging Technical Conference and Exhibition (IPACK'03), July 6-11, 2003, Maui, Hawaii, USA (CD-ROM)]
    Y. Ju, M. Saka and H. Abé
    
    
12. Nondestructive Inspection of Chip Size Package by Millimeter Waves [Proc. Int. Electronic Packaging Technical Conference and Exhibition (IPACK'03), July 6-11, 2003, Maui, Hawaii, USA (CD-ROM)]
    Y. Ju, H. Yamamoto and M. Saka
    
    
13. A High-Resolution Dry-Contact Acoustic Imaging of the Solder Joints for Ball Grid Array Assembly [Proc. Int. Electronic Packaging Technical Conference and Exhibition (IPACK'03), July 6-11, 2003, Maui, Hawaii, USA (CD-ROM)]
    H. Tohmyoh and M. Saka
    
    
14. A Method of the Measurement of Moisture in IC Packages Using Microwaves [IEEE Trans. Elect. Pack. Manufacturing, 26 (3), (2003), 228 - 231]
    Y. Ju, M. Saka and H. Abé
    
    
15. Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwaves [Proc. Int. Conf. Advanced Technology in Experimental Mechanics 2003 (ATEM'03), September 10-12, 2003, Nagoya (CD-ROM)]
    Y. Ju, Y. Ohno, M. Saka and H. Abé
    
    
16. An Effective Transmission Technique of Higher Frequency Ultrasound into a Wafer Level Package [Proc. Int. Conf. Advanced Technology in Experimental Mechanics 2003 (ATEM'03), September 10-12, 2003, Nagoya (CD-ROM)]
    Y. Tohmyoh and M. Saka
    
    
17. Effect of Ar Gas Pressure on Growth, Structure, and Mechanical Properties of Sputtered Ti Thin Films [Proc. Int. Conf. Advanced Technology in Experimental Mechanics 2003 (ATEM'03), September 10-12, 2003, Nagoya (CD-ROM)]
    H. Ogawa, S. Kaneko, K. Suzuki and M. Saka
    
    
18. Improvement of Fatigue Strength on Duralumin by Cavitation Shotless Peening [Proc. Int. Conf. Advanced Technology in Experimental Mechanics 2003 (ATEM'03), September 10-12, 2003, Nagoya (CD-ROM)]
    D. O. Macodiyo, H. Soyama, K. Saito and M. Saka
    
    
19. A Dry-Contact Method for Transmitting Higher Frequency Components of Ultrasound [Int. J. Appl. Electromagnetics and Mechanics, 18 (1-3), (2003), 31 - 39]
    H. Tohmyoh and M. Saka
    
    
20. Sensitive Ultrasonic Testing of a Small Closed Crack [Strength, Fracture and Complexity, 1 (2), (2003), 89 - 99]
    M. A. S. Akanda and M. Saka
    
    

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