2001年

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1. Microwave Imaging for the Integrity Assessment of IC Packages [Trans. ASME, J. Electron. Packaging, 123 (1), (2001), 42 - 46]
   Y. Ju, M. Saka and H. Abé
   
   
2. Detection of Delamination in IC Packages Using the Phase of Microwaves [NDT & E Int., 34 (1), (2001), 49 - 56]
   Y. Ju, M. Saka and H. Abé
   
   
3. Nondestructive Inspection of Delamination in IC Packages by High-Frequency Microwaves [NDT & E Int., 34 (3), (2001), 213 - 217]
   Y. Ju, M. Saka and H. Abé
   
   
4. Microwave Measurement of Moisture in Encapsulant Resin of IC Packages [Nondestructive Characterization of Materials X, Elsevier Science, (2001), 129 - 132]
   Y. Ju, S. Sanpei, M. Saka and H. Abé
   
   
5. Recycling Technique for CVD Diamond Coated Cutting Tools [Surf. Coat. Tech., 137, (2001), 246 - 248]
   H. Liu, H. Hanyu, Y. Murakami, S. Kamiya and M. Saka
   
   
6. マイクロ波非破壊検査における集束センサの開発 [非破壊検査, 50 (6), (2001), 392 - 397]
   巨　陽, 猿田賢治, 坂 真澄, 阿部博之
   
   
7. ダイヤモンド被膜の脱膜技術および再生利用工具の性能評価　[精密工学会誌，67(6)，(2001)，937-940]
   劉　浩，羽生博之，村上良彦，神谷庄司，坂　真澄
   
   
8. Backside Damage Introduced by Cavitating Jet for Gettering [Proc. Pacific Rim/ASME Int. Electronic Packaging Technical Conference and Exhibition (IPACK'01), July 8-13, 2001, Kauai, Hawaii, USA (CD-ROM), (2001)]
   H. Kumano, H. Soyama and M. Saka
   
   
9. Verification of the Governing Parameter for Electromigration Damage in Passivated Polycrystalline Line [Proc. Pacific Rim/ASME Int. Electronic Packaging Technical Conference and Exhibition (IPACK'01), July 8-13, 2001, Kauai, Hawaii, USA (CD-ROM),, (2001)]
   K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
   
   
10. Possibility of Gettering Silicon Wafer by Using a CaVitating Jet [J. Jet Flow Eng., 18 (2), (2001), 4 - 9]
    H. Kumano, H. Soyama and M. Saka
    
    
11. Peening by the Use of Cavitation Impacts for the Improvement of Fatigue Strength [J. Mater. Sci. Lett., 20 (13), (2001), 1216 - 1265]
    H. Soyama, T. Kusaka and M. Saka
    
    
12. Cavitating Jet Peening for the Improvement of Fatigue Strength [Mater. Sci. Res. Int., Special Technical Publication, 1, (2001), 216 - 219]
    H. Soyama, K. Sasaki, H. Kumano and M. Saka
    
    
13. Cure Shrinkage Analisis of Epoxy Molding Compound [Polymer Eng. Sci., 41 (8), (2001), 1373 - 1379]
    K.Oota and M. Saka
    
    
14. Nondestructive Inspection of a Small Area Delamination in IC Packages by Microwave Imaging [Proc. Pacific Rim/ASME Int. Electronic Packaging Technical Conference and Exhibition (IPACK'01), July 8-13, 2001, Kauai, Hawai, USA(CD-ROM),, (2001)]
    Y. Ju, M. Saka and H. Abé
    
    
15. マイクロ波による金属材料表面上の閉じた疲労き裂の非破壊評価 [非破壊検査, 50 (9), (2001), 607 - 611]
    坂 真澄, 巨 陽, 羅 大贏, 阿部博之
    
    
16. NDI of Delamination in IC Packages Using Millimeter-Waves [IEEE Trans. Instru. Meas., 50 (4), (2001), 1019 - 1023]
    Y. Ju, M. Saka and H. Abé
    
    
17. Influence of Crack Length on the Ultrasonic Evaluation of Depth of Small Surface Cracks [Proc. of APCFS & ATEM'01, JSME-MMD, October 20-22, 2001, Sendai, Japan, 1, (2001), 253 - 257]
    S. R. Ahmed and M. Saka
    
    
18. Toward a Sensitive Detection and Sizing of Small Closed Cracks by Ultrasonic Shear Waves [Proc. of APCFS & ATEM'01, JSME-MMD, October 20-22, 2001, Sendai, Japan, 1, (2001), 258 - 263]
    M. A. S. Akanda and M. Saka
    
    
19. A Method of Sizing Small Fatigue Crack in Stainless Steel by Microwaves [Proc. of APCFS & ATEM'01, JSME-MMD, October 20-22, 2001, Sendai, Japan, 1, (2001), 286 - 291]
    M. Saka, Y. Ju, D. Luo and H. Abé
    
    
20. Evaluation of Peening Intensity of Cavitation Shotless Peening by Using Almen Strip [Proc. of APCFS & ATEM'01, JSME-MMD, October 20-22, 2001, Sendai, Japan, 2, (2001), 1047 - 1050]
    H. Soyama, H. Kumano, K. Saito and M. Saka
    
    
21. 赤燐難燃剤使用の封止樹脂における高温保管性の向上 [材料科学, 38 (4), (2001), 137 - 143]
    太田 賢, 指田暢幸, 鈴木 達, 出口真吾, 坂 真澄
    
    
22. De-coating Technique for CVD Diamond Coatings And Evaluation of Performance For Recycled Cutting Tools [J. JSPE, 67 (6), (2001), 937 - 940]
    H. Liu, H. Hanyu, Y. Murakami, S. Kamiya and M. Saka
    
    
23. Development of Focusing Sensor For Microwave Nondestructive Inspection [J. JSNDI, 50 (6), (2001), 392 - 397]
    Y. Ju, K. Saruta, M. Saka, H. Abé
    
    
24. Microwave Nondestructive Evaluation of a Closed Fatigue Crack on the Metal Surface [J. JSNDI, 50 (9), (2001), 607 - 611]
    M. Saka, Y. Ju, D. Luo and H. Abé
    
    
25. Effects of Corner Position and Operating Condition on Electromigration Failure in Angled Bamboo Lines without Passivation Layer [Thin Solid Films, 401 (1-2), (2001), 255 - 266]
    K. Sasagawa, M. Hasegawa, K. Naito, M. Saka and H. Abé
    
    

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