Development of a Simple Method for Testing the Electromigration Resistance
The use of Pb-free solders is expanding for environmental consideration. With the rapid downsizing of electronic devices, electromigration which is one of the key factors of line failure has begun to be a concern. For testing the electromigration resistance, a right-angled rhombus-shaped hole was introduced in a thin film of Pb-free solder. A direct current was supplied to the film far from the hole and the flow is maintained perpendicular to the diagonal of the hole. In this way, the current density was made to concentrate near the corner of the hole and a unique method for testing the electromigration resistance of thin films was developed. In addition, the method for measuring the temperature in a very small area of an object by contacting the chemical reagents with known melting points was developed. By the method, measurement of surface temperature of solders under current flow and atmospheric conditions has been successfully conducted.
Fig.5 Development of EM resistance evaluation method
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