Original Papers 2016
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Influence of a Hot and Humid Environment on Thermal Transport across the Interface between a Ag Thin-film Line and a Substrate Applied Surface Science
[Applied Surface Science, 368, (2016), 267 - 271]
Y. Li, K. Noguchi and M. Saka
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Forming Long Ag Thin Wires by Using Stress Migration
[Mater. Lett., 171, (2016), 72 - 74]
Y. Lu, Y. Li and M. Saka
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A Plate-type Thermoelectric Power Generator with an Oxidized Bi-metal Interface for Power Generation from a Small Temperature Difference
[Microelectronic Engineering, 159, (2016), 38 - 41]
H. Tohmyoh and T. Daimon
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A Direct Current Potential Drop Method for Evaluating Oxide Film Thickness Formed in High-temperature Water
[Mech. Eng. Letters, 2, (2016), 8pages]
H. Anzai, R. Ishibashi and M. Saka
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Buried Structure for Increasing Fabrication Performance of Micromaterial by Electromigration
[Jpn. J. Appl. Phys., 55, (2016), 06GH01-1 - 06GH01-5]
Y. Kimura and M. Saka
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Change in the Waveform of Broadband Ultrasound Reflected Back from a Sample Via a Polymer Film
[Jpn. J. Appl. Phys., 55, (2016), 078001-1 - 078001-3]
H. Tohmyoh and S. Mukaimine
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Effect of Temperature on Preventing Electromigration Damage Based on Increasing Threshold Current Density in a Thin Metal Passivated Line
[Mech. Eng. Letters, 2, (2016), 7pages]
H. Ikadai, Y. Kimura and M. Saka
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Multi-layered Microwire with a Bi-metal Tip for Thermoelectric Applications
[Appl. Therm. Eng., 107, (2016), 747 - 749]
S. E. Siukonen, T. Daimon and H. Tohmyoh
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Influence of Local Thermal Dissipation on Electromigration in an Al Thin-film Line
[Microelectronics Reliability, 65, (2016), 178 - 183]
Y. Li, H.-T. Lee and M. Saka
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Suitable Passivation Thickness on a Metal Line to Prevent Electromigration Damage
[Mater. Lett., 184, (2016), 219 - 222]
Y. Kimura, H. Ikadai, T. Nakakura and M. Saka
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Controlling Surface Morphology of Sn Thin-film to Enhance Cycling Performance in Lithium Ion Batteries
[Materials Research Bulletin, 87, (2016), 155 - 160]
Y. Li, R. Matsuura and M. Saka
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