Original Papers 2016

  1. Influence of a Hot and Humid Environment on Thermal Transport across the Interface between a Ag Thin-film Line and a Substrate Applied Surface Science
    [Applied Surface Science, 368, (2016), 267 - 271]
    Y. Li, K. Noguchi and M. Saka

  2. Forming Long Ag Thin Wires by Using Stress Migration
    [Mater. Lett., 171, (2016), 72 - 74]
    Y. Lu, Y. Li and M. Saka

  3. A Plate-type Thermoelectric Power Generator with an Oxidized Bi-metal Interface for Power Generation from a Small Temperature Difference
    [Microelectronic Engineering, 159, (2016), 38 - 41]
    H. Tohmyoh and T. Daimon

  4. A Direct Current Potential Drop Method for Evaluating Oxide Film Thickness Formed in High-temperature Water
    [Mech. Eng. Letters, 2, (2016), 8pages]
    H. Anzai, R. Ishibashi and M. Saka

  5. Buried Structure for Increasing Fabrication Performance of Micromaterial by Electromigration
    [Jpn. J. Appl. Phys., 55, (2016), 06GH01-1 - 06GH01-5]
    Y. Kimura and M. Saka

  6. Change in the Waveform of Broadband Ultrasound Reflected Back from a Sample Via a Polymer Film
    [Jpn. J. Appl. Phys., 55, (2016), 078001-1 - 078001-3]
    H. Tohmyoh and S. Mukaimine

  7. Effect of Temperature on Preventing Electromigration Damage Based on Increasing Threshold Current Density in a Thin Metal Passivated Line
    [Mech. Eng. Letters, 2, (2016), 7pages]
    H. Ikadai, Y. Kimura and M. Saka

  8. Multi-layered Microwire with a Bi-metal Tip for Thermoelectric Applications
    [Appl. Therm. Eng., 107, (2016), 747 - 749]
    S. E. Siukonen, T. Daimon and H. Tohmyoh

  9. Influence of Local Thermal Dissipation on Electromigration in an Al Thin-film Line
    [Microelectronics Reliability, 65, (2016), 178 - 183]
    Y. Li, H.-T. Lee and M. Saka

  10. Suitable Passivation Thickness on a Metal Line to Prevent Electromigration Damage
    [Mater. Lett., 184, (2016), 219 - 222]
    Y. Kimura, H. Ikadai, T. Nakakura and M. Saka

  11. Controlling Surface Morphology of Sn Thin-film to Enhance Cycling Performance in Lithium Ion Batteries
    [Materials Research Bulletin, 87, (2016), 155 - 160]
    Y. Li, R. Matsuura and M. Saka


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