Original Papers 2015

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1. Fast and Uniform Heating of Cu Microwires Using Electrical Current
   [Appl. Phys. Express, 8, (2015), 045503-1 - 045503-3]
   H. Tohmyoh and Y. Matsudo
   
   
2. Welding Dissimilar Metal Microwires by Joule Heating
   [Jpn. J. Appl. Phys., 54, (2015), 06FL01-1 - 06FL01-5]
   T. Sunagawa and H. Tohmyoh
   
   
3. Fabrication of Thermoelectric Circuits by Joining Metallic Microwires and the Effect of the Length of the Wire on the Thermoelectromotive Force
   [Renewable Energy, 83, (2015), 41 - 46]
   A. Watanabe and H. Tohmyoh
   
   
4. A Parameter Governing the Melting Induced at the Micrometer Level in a Dissimilar Metal Wire System by Joule Heating
   [Journal of Applied Physics, 117, (2015), 234901-1 - 234901-5]
   H. Tohmyoh and T. Sunagawa
   
   
5. Evaluation of the Nugget Diameter in Spot Welded Joints between Two Steel Sheets by Means of a Potential Drop Technique
   [Measurement Science and Technology, 26, (2015), 085602-1 - 085602-7]
   H. Tohmyoh, H. Ikarashi, Y. Matsui, Y. Hasegawa and S. Obara
   
   
6. Growth of Ag Micro/Nanoparticles Using Stress Migration from Multilayered Metallic Structure
   [Applied Surface Science, 351, (2015), 1011 - 1015]
   Y. Lu, Y. Li and M. Saka
   
   
7. Evaluation of Electromigration Resistance of Lead-free Solders Using Unpassivated Stripe-shaped Samples
   [Microsyst. Technol., 21 (8), (2015), 1777 - 1785]
   M. Aoyama and M. Saka
   
   
8. Determination of Acoustic Properties of Thin Polymer Films Utilizing the Frequency Dependence of the Reflection Coefficient of Ultrasound
   [Review of Scientific Instruments, 86, (2015), 114901-1 - 114901-6]
   H. Tohmyoh and Y. Sakamoto
   
   
9. Evaluating the Electromigration Resistance of Lead-free Solders by Utilizing the Sharp Tip of a Cu Trace
   [Int. J. Materials and Structural Integrity, 9 (4), (2015), 216 - 227]
   K. Hino and M. Saka
   
   

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