Original Papers 2014

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1. Simplified Processes Using Conductive Passivation Film for the Fabrication of Al Micro-Wires by Electromigration
   [Mater. Lett., 116, (2014), 278 - 281]
   Y. Kimura and M. Saka
   
   
2. Joule Heat Welding for Getting Fine Bi-Metal Junction
   [Proceedings of Mate2014, 20, (2014), 345 - 348]
   H. Tohmyoh, A. Watanabe and T. Sunagawa
   
   
3. Acoustic Study of a Linear Low-Density Polyethylene Film after Modification of the Crystalline Structure by Heating
   [Rev. Sci. Instrum., 85, (2014), 024902-1 - 024902-5]
   H. Tohmyoh and Y. Sakamoto
   
   
4. Fabrication of Multiple Al Micro-materials by Electromigration Using a Comb Pattern and a Conductive Passivation Film
   [Adv. Mater. Res., 909, (2014), 36 - 40]
   Y. Kimura and M. Saka
   
   
5. Use of CrN Passivation for Fabricating Al Micro-materials by Electromigration
   [Adv. Mater. Res., 909, (2014), 67 - 71]
   Y. Kimura, T. Sasaki and M. Saka
   
   
6. Consistent Melting Behavior Induced by Joule Heating between Ag Microwire and Nanowire Meshes
   [Nanoscale Res. Lett., 9, 239, (2014), 8pages (Online)]
   K. Tsuchiya, Y. Li and M. Saka
   
   
7. Analyzing Electromigration Near a Right-Angled Corner Composed of Dissimilar Metals by Investigating the Effect of Material Combination on Atomic Flux Divergence
   [Jpn. J. Appl. Phys., 53 (7), (2014), 075504-1 - 075504-7 (Online)]
   X. Zhao, Y. Kimura and M. Saka
   
   
8. Joule Hat Welding of Thin Wires to Thin Films
   [Mech. Eng. J., 1, (2014), 1 - 10]
   H. Tohmyoh and M. Fujimori
   
   
9. Acoustic Resonant Spectroscopy for Detecting the Degradation of Polymer Film due to Heating
   [Proc. JSME 2014 Int. Conf. on Materials and Processing (ICMP2014), June 9-13, 2014, Detroit, Michigan, USA (CD-ROM: ICMP2014-4911)]
   H. Tohmyoh and Y. Sakamoto
   
   
10. Monitoring the Thermal Oxidation of Thin Polymer Films by Means of Acoustic Resonant Spectroscopy
    [Jpn. J. Appl. Phys., 53, (2014), 086601-1 - 086601-4 (Online)]
    Y. Sakamoto and H. Tohmyoh
    
    
11. Inspection of the Physical Contact between Two Steel Sheets by Means of a Potential Drop Technique
    [NDT&E Int.68, (2014), 28 - 32]
    H. Tohmyoh, H. Ikarashi, Y. Hasegawa, S. Obara and Y. Matsui
    
    
12. Multiple Al Micro Materials Fabrication by Utilizing Electromigration
    [Int. J. Materials and Structural Integrity, 8 (1-3), (2014), 98 - 109]
    R. Zanma and M. Saka
    
    
13. Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders
    [J. Electronic Materials, 43 (Issue 11), (2014), 4179 - 4185]
    X. Zhao, M. Saka, M. Muraoka, M. Yamashita and H. Hokazono
    
    
14. Influence of Thermal Boundary Conditions on Melting Behaviour of an Ag Nanowire Mesh Induced by Joule Heating
    [Recent Advances in Structural Integrity Analysis: Proc. Int. Congress (APCF/SIF-2014), Darlington Campus, University of Sydney, Australia, 9-12 December 2014, (2014), 488 - 493]
    Y. Li, K. Tsuchiya and M. Saka
    
    
15. Trial Fabrication of Al Micro-Materials by Electromigration Using Buildup Structure
    [Recent Advances in Structural Integrity Analysis: Proc. Int. Congress (APCF/SIF-2014), Darlington Campus, University of Sydney, Australia, 9-12 December 2014, (2014), 510 - 514]
    Y. Kimura and M. Saka
    
    
16. Evaluation of Electromigration Near a Corner Composed of Dissimilar Metals by Analyzing Atomic Flux at the Interface
    [Recent Advances in Structural Integrity Analysis: Proc. Int. Congress (APCF/SIF-2014), Darlington Campus, University of Sydney, Australia, 9-12 December 2014, (2014), 515 - 518]
    Y. Kimura, X. Zhao and M. Saka
    
    

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