Original Papers 2013

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1. Detection of Micro-Bubbles in Thin Polymer Films by Means of Acoustic Resonant Spectroscopy [Jpn. J. Appl. Phys., 52 (2), (2013), 2pages]
   H. Tohmyoh and H. Ikarashi
   
   
2. Enhancing Electromigration Resistance of Sn1Ag0.5Cu Solder by Adding Single Ni or Ge Microelement [J. Solid Mech. and Mater. Eng., 7 (1), (2013), 118 - 123]
   X. Zhao, M. Saka, M. Yamashita and H. Hokazono
   
   
3. Estimation and Visualization of the Fatigue Life of Pb-Free SAC Solder Bump Joints under Thermal Cycling [Microelectron. Reliab., 53, (2013), 314 - 320]
   H. Tohmyoh, S. Ishikawa, S. Watanabe, M. Kuroha and Y. Nakano
   
   
4. How to Weld Ultrathin Metallic Wires Stably with Joule Heat [Proceedings of Mate2013, (2013), 185 - 186]
   H. Tohmyoh, M. Fujimori and A. Watanabe
   
   
5. Heat Conduction Model for Nanowire Applications [Appl. Phys. Lett., 102, (2013), 084107-1 - 084107-4]
   H. Tohmyoh
   
   
6. Effect of the Thermomechanical Properties of No-Flow Underfill Materials on Interconnect Reliability [IEEE Trans. Comp., Packag. Manufact. Technol., 3 (3), (2013), 370 - 376]
   S. Katsurayama and H. Tohmyoh
   
   
7. Strength and Fracture Behavior of Ultrathin Pt Wires [Int. J. Fracture, 180 (2), (2013), 269 - 274]
   M.A.S. Akanda and H. Tohmyoh
   
   
8. Fabrication of Single-Crystalline Iron Oxide Fe₃O₄ Nanowires from an Oxidized Fe Plate Subjected to Bending Stress [J. Phys. Soc. Jpn., 82, (2013), 044804-1 - 044804-4]
   H. Tohmyoh and A. Watanabe
   
   
9. Fabrication of Al Microspheres by Electromigration Using a Metal Line with a Sudden Change in Geometrical Shape [Optoelectronics and Advanced Materials - Rapid Communications, 7 (3-4), (2013), 314 - 318]
   F. M. Kamal, Y. Li and M. Saka
   
   
10. Extending the Fatigue Life of Pb-Free SAC Solder Joints Under Thermal Cycling [Microelectron. Reliab., 53, (2013), 741 - 747]
    S. Ishikawa, H. Tohmyoh, S. Watanabe, T. Nishimura and Y. Nakano
    
    
11. Pull-out Simulations of A Capped Carbon Nanotube in Carbon Nanotube-Reinforced Nanocomposites [J. Appl. Phys., 113 (4), (2013), 144304-1 - 144304-7]
    Y. Li, S. Liu, N. Hu, et al.
    
    
12. Joule Heat Welding of Thin Platinum and Tungsten Wires and the Thermoelectric Effects around Bi-Metal Junctions [J. Micro and Nano-Manufact., 1, (2013), 024501-1 - 024501-4]
    H. Tohmyoh, T. Tanaka, M. Fujimori and M. Saka
    
    
13. Welding Thin Pt Wires with Dissimilar Diameters by Joule Heating [Jpn. J. Appl. Phys., 52, (2013), 06GH01-1 - 06GH01-4]
    M. Fujimori and H. Tohmyoh
    
    
14. Electrical Breakdown of a Metallic Nanowire Mesh [13th Int. Conf. on Fracture, June 16-21, 2013, Beijing, China, (2013), 9pages (USB)]
    Y. Li, K. Tsuchiya, H. Tohmyoh and M. Saka
    
    
15. Evaluation on the Factors Influencing Thermal-stress-induced Growth of Sn Nanowires [13th Int. Conf. on Fracture, June 16-21, 2013, Beijing, China, (2013), 7pages (USB)]
    Y. Li, K. Miura, S. Ri and M. Saka
    
    
16. Dynamic Thermal Deformation Measurement of Large-Scale, High-Temperature Piping in Thermal Power Plants Utilizing the Sampling Moiré Method and Grating Magnets [Exp. Mech., (2013), 12pages (Online)]
    S. Ri, M. Saka, K. Nanbara and D. Kobayashi
    
    
17. Local Modification of Cu Microwires by Joule Heating [Appl. Phys. Express, 6, (2013), 077302-1 - 077302-4]
    H. Tohmyoh and M. Ishihara
    
    
18. Characterization of Polymer Thin Coating on Substrate by Acoustic Resonant Spectroscopy
    [Thin Solid Films, 544, (2013), 437 - 442]
    T. Sunaga, H. Tohmyoh and M. Suzuki
    
    
19. Numerical Analysis of the Electrical Failure of a Metallic Nanowire Mesh due to Joule Heating
    [Nanoscale Research Letters, 8, 370, (2013), 9pages (Online)]
    Y. Li, K. Tsuchiya, H. Tohmyoh and M. Saka
    
    
20. Simplified Processes Using Conductive Passivation Film for the Fabrication of Al Micro-Wires by Electromigration
    [Mater. Lett., 116, (2013), 278 - 281 (Online)]
    Y. Kimura and M. Saka
    
    

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