Original Papers 2012
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Comparison of Stress Migration and Electromigration in the Fabrication of Thin Al Wires
[Thin Solid Films, 520 (Issue 9), (2012), 3448 - 3452]
Y. Lu, H. Tohmyoh and M. Saka
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Noncontact Deflection Distribution Measurement for Large-Scale Structures by Advanced Image Processing Technique
[Mater. Trans., 53 (2), (2012), 323 - 329]
S. Ri, T. Numayama, M. Saka, K. Nanbara and D. Kobayashi
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Creep Behavior of Glass-Fiber-Reinforced Nylon 6 Products
[J. Appl. Polym. Sci., 124 (Issue 5), (2012), 4213 - 4221]
H. Tohmyoh, Y. Ito, K. Eguchi, W. Daido, J. Utsunomiya and Y. Nakano
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Accuracy of the Sampling Moiré Method and its Application to Deflection Measurements of Large-Scale Structures
[Exp. Mech., 52 (4), (2012), 331 - 341]
S. Ri, T. Muramatsu, M. Saka, K. Nanbara and D. Kobayashi
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Simultaneous Observation of Acoustic Resonance Phenomena at Both Surfaces of a Plate Coated with Thin Layers
[Rev. Sci. Instrum., 83 (Issue 3), (2012), 034903-1 - 034903-4]
H. Tohmyoh, T. Sunaga and M. Suzuki
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Diffusion-Fatigue Interaction Effect on Hillock Formation in Aluminum Thin Films Under Thermal Cycle Testing
[Mater. Lett., 79, (2012), 139 - 141]
S. Ri and M. Saka
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Growth of Copper Microflowers Assisted by Electromigration Under a Low Current Density and Subsequent Stress-Induced Migration
[Mater. Lett., 79, (2012), 270 - 272]
X. Zhao and M. Saka
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Accurate Measurement of Temperature-Dependent Warpage of Electronic Packaging Using FLCOS-based Fringe Projection Profilometry
[J. Solid Mech. and Mater. Eng., 6 (6), (2012), 721 - 730]
S. Ri, T. Muramatsu, M. Saka, H. Tanaka, Y. Okabe and H. Suzuki
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A Comparison of Electromigration Failure of Metal Lines with Fracture Mechanics
[Acta Mech. Sin., 28 (3), (2012), 774 - 781]
H. Abé, M. Muraoka, K. Sasagawa and M. Saka
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Analysis of the Temperature Field Near a Corner Composed of Dissimilar Metals Subjected to a Current Flow
[Int. J. Heat and Mass Transfer, 55 (Issues 21-22), (2012), 6090 - 6096]
M. Saka and X. Zhao
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Mechanical Properties of Thin Al Wires Prepared by Electromigration
[J. Phys. Soc. Jpn., 81 (9), (2012), 094803-1 - 094803-4]
H. Tohmyoh, M.A.S. Akanda and Y. Nobe
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Non-Contact Evaluation of the Electrical Conductivity of Thin Metallic Films by Eddy Current Microscopy
[Surf. Interface Anal., 44, (2012), 1294 - 1298]
H. Tohmyoh, S. Ishikawa and M. Muraoka
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Manipulation and Joule Heat Welding of Ag Nanowires Prepared by Atomic Migration
[J. Nanopart. Res., 14, (2012), 1116-1 - 1116-9]
H. Tohmyoh and S. Fukui
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Microstructural and Electrical Characterization of Joule Heat Welds in Ultrathin Pt Wires
[Physica E, 46, (2012), 33 - 37]
H. Tohmyoh and M. Fujimori
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Measurement of Coating Thickness Utilizing Acoustic Resonance Phenomenon: On the Comparison of Ultrasonic Transducers
[J. JSNDI., 61 (11), (2012), 597 - 604]
H. Tohmyoh, T. Sunaga, M. Suzuki
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Fast and Accurate Shape Measurement System Utilizing the Fringe Projection Method with a Ferroelectric Liquid-Crystal-On-Silicon Microdisplay
[Opt. Eng., 51 (Issue 8), (2012), 081506-1 - 081516-8]
S. Ri, T. Muramatsu, M. Saka and H. Tanaka
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The Effect of Adding Ni and Ge Microelements on the Electromigration Resistance of Low-Ag Based SnAgCu Solder
[Microsyst. Technol., 18 (12), (2012), 2077 - 2084]
X. Zhao, M. Saka, M. Yamashita and H. Hokazono
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Experimental Study on Mechanical Properties of Epoxy/MWCNT Nanocomposites ? Effects of Acid Treatment, Pressured Curing, and Liquid Rubber
[J. Nanotechnology in Engineering and Medicine, 3, (2012), 011004-1 - 011004-8]
Y. Li, N. Hu, T. Kojima, T. Itoi, T. Watanabe, T. Nakamura, N. Takizawa, T. Inoue, H. Cui, S. Atobe and H. Fukunaga
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Multi-scale Numerical Simulations on Piezoresistivity of CNT/polymer Nanocomposites
[Nanoscale Research Letters, 7, (2012), 402]
B. Hu, N. Hu, Y. Li, K. Akagi, W. Yuan, T. Watanabe and Y. Cai
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A Time-Dependent Direct Current Potential Drop Method to Evaluate Thickness of an Oxide Layer Formed Naturally and Thermally on a Large Surface of Carbon Steel
[Thin Solid Films, 525, (2012), 77 - 83]
M. R. Ali, M. Saka and H. Tohmyoh
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