Original Papers 2011

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1. Forming Microstructures by Controlling the Accumulation and Discharge of Al Atoms by Electromigration [J. Phys. D: Appl. Phys., 44 (4), (2011), 045501 (7pages)]
   Y. Lu, H. Tohmyoh and M. Saka
   
   
2. Small-Span Bending Test for Determination of Elastic-Plastic Properties of Ultrathin Pt Wires [Appl. Phys. A, 103 (Issue 2), (2011), 285 - 291]
   H. Tohmyoh, M. A. S. Akanda and M. Saka
   
   
3. Tip to Side Welding of Ultrathin Pt Wires by Joule Heating [Jpn. J. Appl. Phys. 50 (5), (2011), 057201-1 - 057201-4]
   S. Fukui and H. Tohmyoh
   
   
4. Evaluation Methodology for Stress Concentration in a Structure by 3D Hybrid Sampling Moiré Method [Trans. JSME(A), 77 (777), (2011), 741 - 744]
   S. Ri, T. Numayama, M. Saka, K. Nanbara and D. Kobayashi
   
   
5. Strategy for Advanced Fabrication of Metallic Micro/Nano Materials Using Atomic Diffusion Phenomenon [Proc. JSME/ASME 2011 Int. Conf. on Materials and Processing (ICM&P2011), June 13-17, 2011, Corvallis, Oregon, USA (CD-ROM: ICMP2011-51062)]
   M. Saka and S. Ri
   
   
6. Success Conditions of Welding Ultrathin Pt Wires by Joule Heat [Proc. JSME/ASME 2011 Int. Conf. on Materials and Processing (ICM&P2011), June 13-17, 2011, Corvallis, Oregon, USA (CD-ROM: ICMP2011-51078)]
   H. Tohmyoh, S. Fukui and M. Saka
   
   
7. Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump [Proc. ASME InterPACK2011, July 6-8, 2011, Portland, Oregon, USA (CD-ROM: IPACK2011-52112)]
   S. Ishikawa, H. Tohmyoh, M. Saka, S. Watanabe, M. Kuroha and Y. Nakano
   
   
8. A Phase Compensation Technique of Sampling Moiré Method for Accurate Single-shot Phase Analysis [Advances in Experimental Mechanics VIII, Appl. Mech. and Mater., Eds. R. L. Burguete, M. Lucas, E. A. Patterson and S. Quinn, Vol. 70, (2011), 243 - 248]
   S. Ri, T. Muramatsu and M. Saka
   
   
9. Accurate Determination of the Structural Elasticity of Human Hair by a Small-scale Bending Test [J. Biomech., 44 (Issue 16), (2011), 2833 - 2837]
   H. Tohmyoh, M. Ishihara, M.A. S. Akanda, S. Yamaki, T. Watanabe and T. Iwabuchi
   
   
10. Enhancement of Al Thin Wire Fabrication by Using Electromigration in Relation to the Discharge Resistance of the Atoms [J.Optoelectron. Adv. Mater., 5 (11), (2011), 1219 - 1222]
    Y. Lu, H. Tohmyoh, M. Saka and H. Pan
    
    
11. Precision Friction Measurement Between Ultrathin Wire and Microprobe [Sensors and Actuators A: Physical, 172 (Issue 1), (2011), 189 - 194]
    M.A.S. Akanda, H. Tohmyoh and M. Saka
    
    
12. Thermal Fatigue of High-Purity Aluminum Thin Films Under Thermal Cycle Testing [Strength, Fracture and Complexity, 7 (1), (2011), 61 - 70]
    S. Ri, T. Sugano, M. Saka, M. Yamashita and F. Togoh
    
    
13. An Approach Using Sudden Change in Geometrical Shape of a Sample for Fabricating Micro/Nano Metallic Materials Utilizing Electromigration [Proc. 13th Int. Conf. on Electron. Mater. and Packaging (EMAP2011), December 12-15, 2011, Kyoto, Japan (USB)]
    F. M. Kamal and M. Saka
    
    
14. Multiple Al Micro Materials Fabrication by Utilizing Electromigration [Proc. 13th Int. Conf. on Electron. Mater. and Packaging (EMAP2011), December 12-15, 2011, Kyoto, Japan (USB)]
    R. Zanma and M. Saka
    
    
15. On Melting Phenomenon at Nanocontacts of Thin Metallic Wires in Comparison with Fracture Mechanics [Strength, Fracture and Complexity, 7 (2), (2011), 169 - 175]
    H. Tohmyoh
    
    

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