Original Papers 2009

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1. Heat Conduction in a Symmetric Body Subjected to a Current Flow of Symmetric Input and Output [Int. J. Therm. Sci., 48 (Issue 1), (2009), 114 - 121]
   M. Saka, Y. X. Sun and S. R. Ahmed
   
   
2. A Simple Method for Testing the Electromigration Resistance of Solders [Microsyst. Technol., 15 (1), (2009), 17 - 25]
   M. Saka, T. Kohara, T. Hasegawa and M. Yamashita
   
   
3. Fabrication of Al Micro-Spheres by Utilizing Electromigration [J. Nanosci. Nanotechnol., 9 (3), (2009), 1972 - 1975]
   Y. X. Sun, H. Tohmyoh and M. Saka
   
   
4. Thermoelastic Damping of the Axisymmetric Vibration of Circular Plate Resonators [J. Sound Vib., 319 (Issues 1-2), (2009), 392 - 405]
   Y. Sun and H. Tohmyoh
   
   
5. A Governing Parameter for the Melting Phenomenon at Nanocontacts by Joule Heating and Its Application to Joining Together Two Thin Metallic [J. Appl. Phys., 105, (2009), 014907-1 - 014907-9]
   H. Tohmyoh
   
   
6. An Effective Method of Local Thermal Treatment for Sensitive NDE of Closed Surface Cracks [Res. Nondestruct. Eval., 20 (Issue 1), (2009), 51 - 70]
   S. Reaz Ahmed, M. Saka, Y. Matsuura, D. Kobayashi, Y. Miyachi and Y. Kagiya
   
   
7. Formation of Metallic Micro/Nanomaterials by Utilizing Migration Phenomena and Techniques for Their Application [Mater. Sci. Forum, 614, (2009), 3 - 9]
   M. Saka, H. Tohmyoh, M. Muraoka,Y. Ju and K. Sasagawa
   
   
8. Fabrication of a Free-Standing Pt Micro-Ring on an Electrode Chip as a Small Magnetic Source [J. Micromech. Microeng., 19, (2009), 085013, 5pages.]
   H. Tohmyoh, H. Takeda and M. Saka
   
   
9. Displacement Distribution Measurement and Stress Distribution Evaluation Technique by Using Hybrid Sampling Moiré Method [J. JSEM, 9 (2), (2009), 109 - 115]
   S. Ri, T. Numayama and M. Saka
   
   
10. Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering [Proc. ASME 2009 InterPACK Conf., July 19-23, 2009, San Francisco, California, USA (CD-ROM: InterPACK2009-89282), (2009)]
    X. Zhao, M. Saka, M. Yamashita and F. Togoh
    
    
11. Hybrid Moiré Method for Three-dimensional Stress Analysis [Proc. 12th Int. Conf. Fracture, July 12-17, 2009, Ottawa, Canada (CD-ROM, 9pages), (2009)]
    S. Ri, T. Numayama and M. Saka
    
    
12. Sensitivity of Acoustic Microscopy for Detecting Three-Dimensional Nanometer Gaps Embedded in a Silicon Structure [J. Acoust. Soc. Am., 126 (1), (2009), 98 - 102.]
    H. Tohmyoh and M. A. S. Akanda
    
    
13. Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability [Trans. ASME, J. Electron. Packaging, 131, (2009), 031005-1 - 031005-5.]
    S. Katsurayama and H. Tohmyoh
    
    
14. A Numerical Simulation of Nanostructure Formation Utilizing Electromigration [J. Electron. Mater., 38 (10), (2009), 2201 - 2206.]
    K. Sasagawa, S. Fukushi, Y. Sun and M. Saka
    
    
15. Fabrication of Al Micro-Belts by Utilizing Electromigration [Mater. Lett., 63 (26), (2009)], 2227 - 2229.
    Y. B. Lu and M. Saka
    
    
16. Effect of Purity on the Fabrication of Al Micro/Thin-Materials by Utilizing Electromigration [Mater. Lett., 63 (27), (2009)], 2294 - 2296.
    Y. B. Lu and M. Saka
    
    
17. Determination of Elastic-Plastic Properties of Metallic Thin Wires by Small-Span Bending Test [Proc. 12th Int. Conf. Fracture, July 12-17, 2009, Ottawa, Canada (CD-ROM), (2009)], Paper No. T22.010.
    H. Tohmyoh, M.A.S. Akanda, H. Takeda and M. Saka
    
    
18. Manipulation of Thin Metallic Wires by Joule Heat Joining [Proc. ASME 2009 InterPACK Conf., July 19-23, 2009, San Francisco, California, USA (CD-ROM), (2009)], Paper No. IPACK2009-89122.
    H. Tohmyoh, H. Takeda, M.A.S. Akanda and M. Saka
    
    
19. Measurement of the Coating Thickness on the Back Side of Double-sided Coated Structures by Means of Acoustic Resonant Spectroscopy [Surf. Coat. Tech., 204 (Issue 4), (2009)], 546 - 550.
    H. Tohmyoh and M. Suzuki
    
    
20. Derivation of Film Characteristic Constants of Polycrystalline Line for Reliability Evaluation Against Electromigration Failure [Mech. Mater., 41 (Issue 10), (2009), 1090 - 1095]
    M. Hasegawa, K. Sasagawa, S. Uno, M. Saka and H. Abé
    
    
21. Selection of a Solid Layer for High-resolution Acoustic Imaging of IC Packaging Defects Under Dry-contact Conditions [Mech. Mater., 41 (Issue 10), (2009)], 1172 - 1178.
    H. Tohmyoh, M. Saka and T. Akaogi
    
    
22. Evaluation of Mechanical and Electrical Properties of Very-Thin Pt Wires by Utilizing Joining Technique with Joule Heating [J. Soc. Mat. Sci., Japan, 58 (10), (2009), 847 - 851]
    H. Tohmyoh, H. Takeda and M.A.S. Akanda
    
    
23. Self-Completed Joule Heat Welding of Ultrathin Pt Wires [Phys. Rev. B, 80 (Issue 15), (2009), 155403-1 - 155403-7]
    H. Tohmyoh and S. Fukui
    
    
24. Single-shot Three-dimensional Shape Measurement Method Using the DMD Camera by Fringe Projection [Opt. Eng. 48 (Issue 10), (2009), 103605 (8pages)]
    S. Ri, M. Fujigaki and Y. Morimoto
    
    

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