Original Papers 2007

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1. Thermal Opening Technique for Nondestructive Evaluation of Closed Cracks [Trans. ASME, J. Press. Vess. Technol., 129 (Issue 1), (2007), 103 - 108]
   H. Tohmyoh, M. Saka and Y. Kondo
   
   
2. Selecting Suitable Probes Distances for Sizing Deep Surface Cracks Using the DCPD Technique [Trans. ASME, J. Press. Vess. Technol., 129 (1), (2007), 205 - 210]
   F. Takeo, M. Saka, S. R. Ahmed, S. Hamada and M. Hayakawa
   
   
3. Rapid and Mass Growth of Stress-Induced Nanowhiskers on the Surfaces of Evaporated Polycrystalline Cu Films [Scripta Mater., 56 (Issue 12), (2007), 1031 - 1034]
   M. Saka, F. Yamaya and H. Tohmyoh
   
   
4. A Simple and Direct Method for Local Temperature Measurement and Its Applications to Materials Evaluations [Key Eng. Mat., Vols.345-346, (2007), 1279 - 1282]
   T. Hasegawa, T. Kohara and M. Saka
   
   
5. Rubber-Coupled Acoustic Microscopy for Dry Inspections of Industrial Products [NDT & E Int., 40 (Issue 5), (2007), 368 - 373]
   H. Tohmyoh and T. Akaogi
   
   
6. Enhancing Repeatability in the Measurement of Potential Drop Using an Adjustable Four-Point-Probe Measuring System [Res. Nondestruct. Eval., 18 (Issue 2), (2007), 69 - 100]
   S. R. Ahmed and M. Saka
   
   
7. Electro-Thermal Problems near the Corner of Diamond-Shaped Hole Having Right-Angle in a Plate under a Direct Current Flow [Trans. JSME(A), 73 (729), (2007), 651 - 658]
   T. Hasegawa and M. Saka
   
   
8. Measurement of Potential Drop Distribution by Scanning the Closely Coupled Probes Sensor for Sensitive NDE of Shallow Surface Cracks [Mater. Trans., 48 (6), (2007), 1166 - 1172]
   H. Tohmyoh, T. Suzuki, S. R. Ahmed and M. Saka
   
   
9. Reliability Analysis of Solderless Press-Fit Interconnections [Proc. ASME InterPACK '07, July 8-12, 2007, Vancouver, British Columbia, Canada, (2007), (CD-ROM: IPACK2007-33264)]
   H. Tohmyoh, K. Yamanobe, M. Saka, J. Utsunomiya, T. Nakamura and Y. Nakano
   
   
10. Reliability of Flip Chip Package Depending on Underfill Encapsulating Processes [Proc. ASME InterPACK '07, July 8-12, 2007, Vancouver, British Columbia, Canada, (2007), (CD-ROM: IPACK2007-33562)]
    S. Katsurayama and M. Saka
    
    
11. Welding of Pt Nanowires by Joule Heating [Scripta Mater., 57 (Issue 10), (2007), 953 - 956]
    H. Tohmyoh, T. Imaizumi, H. Hayashi and M. Saka
    
    
12. Quantitative Measurement of Submicrometre Electrical Conductivity [J. Phys. D: Appl. Phys., 40 (23), (2007), 7467 - 7470]
    B.-F. Ju, Y. Ju and M. Saka
    
    
    
    

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