Original Papers 2006

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1. Fabrication of Al Thin Wire by Utilizing Controlled Accumulation of Atoms Due to Electromigration [Mater. Lett., 60 (Issues 17-18), (2006), 2129 - 2131]
   M. Saka and R. Nakanishi
   
   
2. Direct Measurement of Local Surface Temperature of Eutectic Solder for Determining Electromigration Pattern [J. Electron. Mater., 35 (5), (2006), 1074 - 1081]
   T. Hasegawa, M. Saka and Y. Watanabe
   
   
3. Electromigration Failure of Metal Lines [Int. J. Fracture, 138 (1-4), (2006), 219 - 240]
   H. Abé, K. Sasagawa and M. Saka
   
   
4. Measurement of Electrical Conductivity of Micron-Scale Metallic Wires [Trans. Nonferrous Met. Soc. China, 16, (2006), 759 - 762]
   B.-F. Ju, Y. Ju and M. Saka
   
   
5. Polymer Acoustic Matching Layer for Broadband Ultrasonic Applications [J. Acoust. Soc. Am., 120 (1), (2006), 31 - 34]
   H. Tohmyoh
   
   
6. Determination of Friction Coefficient of a Press-Fit Pin in Thin Plating [JSME Int. J. (A), 49 (3), (2006), 363 - 369]
   H. Tohmyoh, K. Yamanobe, M. Saka, J. Utsunomiya, T. Nakamura and Y. Nakano
   
   
7. Quantitative Testing of Small, Tight Backwall Cracks in Steel Objects Using Ultrasonic Longitudinal Waves [Mater. Eval., 64 (8), (2006), 797 - 808]
   S. R. Ahmed and M. Saka
   
   
8. DC Potential-Drop Technique for the Evaluation of 3-D Back-Wall Cracks in Steel Structures [Key Eng. Mat., 321-323, (2006), 434 - 440]
   S. R. Ahmed, M. Saka and F. Takeo
   
   
9. Sensitive Ultrasonic NDE of Tightly Closed Small Cracks in Carbon Steel Structures [Key Eng. Mat., 321-323, (2006), 644 - 648]
   S. R. Ahmed and M. Saka
   
   
10. Acoustic Resonant Spectroscopy for Characterization of Thin Polymer Films [Rev. Sci. Instrum., 77 (104901), (2006), 104901-1 - 104901-3]
    H. Tohmyoh, T. Imaizumi and M. Saka
    
    
11. Potential of Acoustic Imaging in the Detection of Nanometer Gaps [IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 53 (12), (2006), 2481 - 2483]
    H. Tohmyoh, M. Saka and H. Hirayama
    
    
12. Dry Acoustic Microscopy for Non-Destructive Evaluation of Electronic Materials (Selection of a Solid Layer for High-Resolution Inspection) [Trans. JSME(A), 72 (724), (2006), 1832 - 1837]
    H. Tohmyoh and M. Saka
    
    

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