Original Papers 2005

  1. Nondestructive Sizing of a 3D Surface Crack Generated in a Railway Component Using Closely Coupled Probes for Direct-Current Potential Drop Technique [Engineering Fracture Mechanics, Vol.72, Issue 2, (2005), 319 - 334]
    M. Akama and M. Saka

  2. A Comparative Study of the Mechanical Strength of Chemical Vapor-Deposited Diamond and Physical Vapor-Deposited Hard Coatings [Thin Solid Films, Vol.473, No.1, (2005), 123 - 131]
    S. Kamiya, H. Nagasawa, K. Yamanobe and M. Saka

  3. Microwave NDE of a Small 3-D Crack on the Surface of Stainless Steel [Proc. 11th International Conference on Fracture, Turin (Italy), March 20-25, (2005), CD-ROM]
    Y. Ju, M. Saka and Y. Uchimura

  4. Derivation of Film Characteristic Constants by Using Governing Parameter for Electromigration Damage in Passivated Bambooline [Proc. 11th International Conference on Fracture, Turin (Italy), March 20-25, (2005), CD-ROM]
    M. Hasegawa, K. Sasagawa and M. Saka

  5. High-Resolution Acoustic Imaging via the Dry-Coupling Interface without Including Nano-Meter Size Air Gaps [Proc. Third US-Japan Symposium on Advancing Applications and Capabilities in NDE, Hawaii (USA), June 20-24, (2005), CD-ROM]
    H. Tohmyoh, M. Saka and H. Sakai

  6. Effect of the Inner Hardness Distribution on NDE of Case Depth by Means of Four-Point Probes Method [Proc. Third US-Japan Symposium on Advancing Applications and Capabilities in NDE, Hawaii (USA), June 20-24, (2005), CD-ROM]
    F. Takeo, Y. Aonahata and M. Saka

  7. Acoustic Microscopy for Micro Electrical Interconnections [Proc. ASME InterPACK '05, San Francisco, California (USA), July 17-22, (2005), CD-ROM (IPACK2005-73061) ]
    H. Tohmyoh, T. Akaogi and M. Saka

  8. Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines [Proc. ASME InterPACK '05, San Francisco, California (USA), July 17-22, (2005), CD-ROM (IPACK2005-73133) ]
    K. Sasagawa, S. Uno, N. Yamaji and M. Saka

  9. Development of a New Microscopic Four-Point AFM Probe for the Measurement of Local Electrical Conductivity [Proc. ASME InterPACK '05, San Francisco, California (USA), July 17-22, (2005), CD-ROM (IPACK2005-73433) ]
    B. F. Ju, Y. Ju and M. Saka

  10. Microscopic Four-Point Atomic Force Microscope Probe Technique for Local Electrical Conductivity Measurement [Review of Scientific Instruments, Vol.76, No.086101, (2005), online]
    Y. Ju, B. F. Ju and M. Saka

  11. Evaluation of the Shape and Size of 3D Cracks Using Microwaves [NDT & E International, Vol.38, No.8, (2005), 726 - 731]
    Y. Ju, M. Saka and Y. Uchimura

  12. Contactless Measurement of Electrical Conductivity of Si Wafers Independent of Wafer Thickness [Applied Physics Letters, Vol.87, No.16, (2005), 162102-1 - 162102-3]
    Y. Ju, Y. Hirosawa, H. Soyama and M. Saka

  13. Formation of Metallic Nanowires by Utilizing Electromigration [J. Mater. Res., Vol.20, No.10, (2005), 2712 - 2718]
    M. Saka and R. Ueda

  14. Development of Crack Depth Indicator for Deep Surface Crack [Proc. 2005 ASME International Mechanical Engineering Congress and Exposition, November 5-11, (2005), CD-ROM (IMECE2005-79867)]
    M. Hayakawa, S. Hamada, F. Takeo and M. Saka

  15. DC Potential Drop Technique Selecting Probes Distances Properly for Sizing Deep Surface Cracks [Proc. 2005 ASME International Mechanical Engineering Congress and Exposition, November 5-11, (2005), CD-ROM (IMECE2005-79877)]
    F. Takeo, M. Saka, S. Hamada and M. Hayakawa

  16. Verification of Prediction Method for Electromigration Failure Using Angled Polycrystalline Line [Key Engineering Materials, Vols.297-300, (2005), 263 - 268]
    S. Uno, M. Hasegawa, K. Sasagawa and M. Saka

  17. Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-free Solders [Key Engineering Materials, Vols.297-300, (2005), 837 - 843]
    T. Hasegawa and M. Saka

  18. A Methodology for Damage Strength Evaluation of a Single Biomimetic Microcapsule [Key Engineering Materials, Vols.297-300, (2005), 1730 - 1735]
    B. F. Ju, Y. Ju and M. Saka

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