Original Papers 2004

  1. X-Ray Fractography for (α{γ) Dual Phase Stainless Steels Using Parameter ΔεP Obtained from Micromechanics [J. Soc. Mat. Sci., Japan, 53 (2), (2004), 157 - 162]
    H. Hirose, T. Sasaki and M. Saka

  2. On Microwave Dual Frequency Technique for Evaluation of Surface Cracks [Key Engineering Materials, Vols. 261-263, (2004), 955 - 961]
    M. Saka, Y. Ju, Y. Uchimura and T. Miyadu

  3. Effect of Cavitation Number on the Improvement of Fatigue Strength of Carburized Steel Using Cavitation Shotless Peening [Key Engineering Materials, Vols. 261-263, (2004), 1245 - 1250]
    D.O. Macodiyo, H. Soyama and M. Saka

  4. Evaluation of the Damage for Gettering in Silicon Wafer Introduced by a Cavitating Jet [Key Engineering Materials, Vols. 261-263, (2004), 1403 - 1408]
    H. Kumano, H. Soyama and M. Saka

  5. Gettering of Cu in Silicon Wafer by Using Cavitation Impacts [Key Engineering Materials, Vols. 261-263, (2004), 1409 - 1414]
    H. Kumano, H. Soyama and M. Saka

  6. Design and Performance of a Thin, Solid Layer for High-Resolution, Dry-Contact Acoustic Imaging [IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 51 (4), (2004), 432 - 438]
    H. Tohmyoh and M. Saka

  7. Relationship Between Closure Stress of Small Fatigue Crack and Ultrasonic Response [Journal of Nondestructive Evaluation, 23 (2), (2004), 37 - 47]
    M. A. S. Akanda and M. Saka

  8. Ultrasonic Measurement of the Crack Depth and the Crack Opening Stress Intensity Factor Under a No Load Condition [Journal of Nondestructive Evaluation, 23 (2), (2004), 49 - 63]
    M. Saka and M. A. S. Akanda

  9. Effective Transmission of High Frequency Ultrasound into a Silicon Chip through a Polymer Layer [JSME International Journal (A), 47 (3), (2004), 287 - 293]
    H. Tohmyoh and M. Saka

  10. Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwave [JSME International Journal (A), 47 (3), (2004), 294 - 297]
    Y. Ju, Y. Ohno, M. Saka and H. Abé

  11. An Evaluation of Adhesive Toughness of Cu Thin Film on Substrate [J. Soc. Mat. Sci., Japan, 53 (8), (2004), 846 - 849]
    M. Hasegawa, S. Suzuki, S. Kamiya and M. Saka

  12. Quantitative Evaluation of Closed Cracks on the Surface of Stainless Steel by Microwaves [J. Soc. Mat. Sci., Japan, 53 (8), (2004), 900 - 905]
    Y. Ju, T. Miyadu, Y. Uchimura, H. Soyama and M. Saka

  13. A Method for Quantitative Evaluation of Electrical Conductivity of Silicon Wafers by Millimeter-Waves [Key Engineering Materials, Vols. 270-273, (2004), 41 - 45]
    Y. Ju, Y. Ohno and M. Saka

  14. Arrangement of Probes for Measuring Case Depth by Means of Four-Point Probes [Key Engineering Materials, Vols. 270-273, (2004), 82 - 88]
    F. Takeo, K. Nakajima, T. Baba, Y. Aonohata and M. Saka

  15. Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks [Key Engineering Materials, Vols. 270-273, (2004), 913 - 920]
    M. Saka, T. Miyadu and Y. Ju

  16. Ultrasonic NDE of Closed Cracks - Sizing and Evaluation of Crack Opening Stress Intensity Factor under a No Load Condition [Key Engineering Materials, Vols. 270-273, (2004), 1277 - 1284]
    M. Saka, M. A. S. Akanda and S. R. Ahmed



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