Original Papers 2002

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1. Governing Parameter For Electromigration Damage In The Polycrystalline Line Covered With A Passivation Layer [Journal of Applied Physics, 91 (4), (2002), 1882 - 1890]
   K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
   
   
2. Crack Length Independent Evaluation of Depth of Small Surface Cracks [Materials Evaluation, 60 (4), (2002), 535 - 544]
   S. R. Ahmed and M. Saka
   
   
3. Development of a Microwave Focusing Sensor for Nondestructive Evaluation of Materials [Electromagnetic Nondestructive Evaluation (VI), , (2002), 269 - 275]
   Y. Ju, K. Saruta, M. Saka and H. Abé
   
   
4. Measurement of Water Absorption in Ball Grid Array Package [IEEE Transactions on Components and Packaging Technologies, 25 (1), (2002), 164 - 168]
   K. Oota, H. Iida and M. Saka
   
   
5. Ultrasonic Shear Wave Technique for Sensitive Detection and Sizing of Small Closed Cracks [JSME International Journal (A), 45 (2), (2002), 252 - 261]
   M. A. S. Akanda and M. Saka
   
   
6. Prediction of Electromigration Failure in Passivated Polycrystalline Line [Journal of Applied Physics, 91 (11), (2002), 9005 - 9014]
   K. Sasagawa, M. Hasegawa, M. Saka and H. Abé
   
   
7. Improvement of Fatigue Strength of Aluminum Alloy by Cavitation Shotless Peening [Transactions of the ASME, Journal of Engineering Materials and Technology, 124 (2), (2002), 135 - 139]
   H. Soyama, K. Saito and M. Saka
   
   
8. Development of Ultrasonic Probe for Detecting Near Surface Flaws - Application to the Evaluation of Sprayed Coating - [Journal of JSNDI, 51 (6), (2002), 352 - 357]
   H. Yamamoto, Y. Takishita and M. Saka
   
   
9. Influence of Wall Thickness on the Ultrasonic Evaluation of Small Closed Surface Cracks and Quantitative NDE [Journal of Nondestructive Evaluation, 21 (1), (2002), 9 - 22]
   S. R. Ahmed and M. Saka
   
   
10. Dry-Contact Ultrasonic Imaging Under Optimum Transmission Conditions [Proc. 6th Far-East Conference on Nondestructive Testing (FENDT '02)�@, , (2002), 385 - 390]
    H. Tohmyoh and M. Saka
    
    
11. Nondestructive Detection of Small Cracks in Polycrystalline Silicon Substrates Using Millimeter Waves [Proc. 6th Far-East Conference on Nondestructive Testing (FENDT '02), , (2002), 535 - 539]
    Y. Ju, M. Saka and T. Hiroshima
    
    
12. Development of a Dry-Contact Ultrasonic Technique and Its Application to NDE of IC Packages [Recent Advances in Experimental Mechanics, inHonor of Isaac M. Daniel, ed. by Emmanuel E. Gdoutos, , (2002), 443 - 454]
    H. Tohmyoh and M. Saka
    
    
13. Contactless Measurement of Electrical Conductivity of Semiconductor Wafers Using the Reflection of Millimeter Waves [Applied Physics Letters, 81 (19), (2002), 3585 - 3587]
    Y. Ju, K. Inoue, M. Saka and H. Abé
    
    
14. A Method for Sizing Small Fatigue Cracks in Stainless Steel Using Microwaves [JSME International Journal (A), 45 (4), (2002), 573 - 578]
    M. Saka, Y. Ju, D. Luo and H. Abé
    
    
15. Development of High Performance Diamond-Coated Drills for Cutting High Silicon Aluminum Alloy [Thin Solid Films, 413, (2002), 139 - 146]
    H. Hanyu, S. Kamiya, H. Odagi, Y. Murakami and M. Saka
    
    
16. Simulation of Electromigration Failure in Angled Polycrystalline Line Covered with Passivation Layer [Advances in Computational Engineering & Sciences (CD-ROM), (2002), paper-ID 86]
    M. Hasegawa, K. Sasagawa, M. Saka and H. Abé
    
    
17. Failure Simulation of Angled Polycrystalline Lines Covered with Passivation Layer [Proc. 2002 ASME International Mechanical Engineering Congress & Exposition (CD-ROM), ASME, (2002), paper-ID IMECE2002-39677]
    M. Hasegawa, K. Sasagawa, M. Saka and H. Abé
    
    

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