International Conference on Materials & Processing 2022 (ICM&P2022)
Okinawa Shichoson Jichi Kaikan（Naha-shi）, 11/06～10/2022
「Formation of long Al and Fe whiskers by using stress‐induced migration」
Thomas H. Ludwig, Hironori Tohmyoh
No. Tu-2B-1
「Exploration of fabrication conditions for 3D‐printed short‐fiber CFRP by process informatics」
Keiichi Shirasu, Yudai Yamaguchi, Yamato Hoshikawa, Hironori Tohmyoh, Tomonaga Okabe
No. Tu-3B-2
The 43rd Symposium on Ultrasonic Electronics (USE2022)
Doshisha University（Kyoto-shi）, 11/07~09/2022
「Acoustic Study of Photoresist Films Applied under Various Conditions」
Hyelin Kim, Hironori Tohmyoh
No. 2E1-3
35th International Microprocesses and Nanotechnology Conference (MNC2022)
JR Hotel Clement Tokushima（Tokushima-shi）, 11/08～11/2022
「Electrical characteristics of p-CuO nanowire/n-TiO2 thin film heterojunctions fabricated by stress-induced migration」
Yoshinari Kimura, Hironori Tohmyoh
No. 9D-4-3
第13回マイクロ・ナノ工学シンポジウム
ASTY Tokushima（Tokushima-shi）, 11/14～16/2022
「On the performance of solution sensing of copper oxide nanowire sensors with different geometry」
Yoshinari Kimura, Hironori Tohmyoh
No. 14P5-PN-3
「On the improvement of thermoelectric performance by stacking the plate-type thermoelectric power elements」
Masanari Imada, Yoshinari Kimura, Hironori Tohmyoh
No. 16P2-PN-2