We are pleased to invite an engineer from DISCO Corporation to MNC to give a seminar on \u201cDicer Basics\u201d.
We hope that all interested persons, regardless of whether or not they have used a dicer before, and regardless of whether they are faculty members or students, will attend this seminar.<\/p>\n\n\n\n
This is a valuable opportunity for you to directly ask questions about the basics of dicers and your daily questions to the technicians.
No advance notice is required, so please come to the seminar venue on the day of the seminar.
We look forward to your participation.<\/p>\n\n\n\n
Speakers:
DISCO Corporation
\u3000MPS Team, Product Support Group, Precision Diamond Technology Department, Technology Development Division
\u3000Tetsuya Sakanishi
Product Support Group PA Team, Precision Diamond Technology Department, Technology Development Division, DISCO Corporation
\u3000Precision Diamond Technology Department, Technology Development Division, DISCO Corporation
\u3000Masahiro Kobayashi<\/p>\n\n\n\n
Lecture Title:
Company profile of DISCO Corporation
About cutting process (dicing) and blades
Elements of blades
About Dressing
DISCO blade lineup
Introduction of the latest blades<\/p>\n\n\n\n
Location:
MNC 3rd floor, Seminar Room<\/p>\n\n\n\n
Date & Time:
Wednesday, June 5, 2:00 p.m. – (about 60 minutes including Q&A)<\/p>","protected":false},"excerpt":{"rendered":"
We are pleased to invite an engineer from DISCO Corporation to MNC to give a seminar on \u201cDicer Basics\u201d.We hope […]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[1],"tags":[],"yoast_head":"\n