{"id":142,"date":"2022-01-12T10:51:47","date_gmt":"2022-01-12T01:51:47","guid":{"rendered":"https:\/\/web.tohoku.ac.jp\/mnc\/?page_id=142"},"modified":"2026-01-20T14:15:14","modified_gmt":"2026-01-20T05:15:14","slug":"equipment06","status":"publish","type":"page","link":"https:\/\/web.tohoku.ac.jp\/mnc\/en\/facilities\/equipment06","title":{"rendered":"Bonding, polishing, packaging"},"content":{"rendered":"<dl class=\"localnav\">\n\t<dt>table of contents<\/dt>\n\t<dd><ul><li><a href=\"\/mnc\/facilities\/equipment01\">Lithography\/exposure\/drawing equipment<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment02\">Film formation\/deposition<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment03\">Film processing\/etching<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment04\">Synthesis, heat treatment, doping<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment05\">Surface treatment<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment06\">Bonding, polishing, packaging<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment07\">Shape\/morphology observation, analysis<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment08\">Sample preparation equipment<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment09\">Electrical measurement<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment10\">Mechanical measurement<\/a><\/li><li><a href=\"\/mnc\/facilities\/equipment11\">Others<\/a><\/li><\/ul><\/dd>\n<\/dl>\n\n\n\n<h2>Bonding, polishing, packaging<\/h2>\n\n\n\n<h3 id=\"equipment06-01\">EVG wafer bonder\uff08EV520)<\/h3>\n\n\n\n<div class=\"wp-container-51 wp-block-columns\">\n<div class=\"wp-container-49 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/21.jpg\" alt=\"EVG wafer bonder\uff08EV520)\" class=\"wp-image-826\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/21.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/21-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-50 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>EV Group (EVG520)\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum sample size<\/th><td>4 inch<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum generated force (load)<\/th><td>3500 N<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum temperature<\/th><td>550 \u2103<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Chamber vacuum degree<\/th><td>10\u2212<sup>2<\/sup>&nbsp;Pa<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum applied voltage<\/th><td>1200 V<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td>Bond alignment is possible with the EVG mask aligner installed in this facility\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"equipment06-02\">Wafer bonder (Technofine)<\/h3>\n\n\n\n<div class=\"wp-container-54 wp-block-columns\">\n<div class=\"wp-container-52 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/09-4.jpg\" alt=\"Wafer bonder (Technofine)\" class=\"wp-image-831\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/09-4.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/09-4-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-53 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>Technofine (SG-560)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum sample size<\/th><td>4 inch<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum generated force (load)<\/th><td>10000 N<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum temperature<\/th><td>350 \u2103<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Chamber vacuum<\/th><td>5 x 10\u2212<sup>3<\/sup>&nbsp;Pa<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum applied voltage<\/th><td>Not compatible<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"equipment06-03\">Flip chip bonder #1<\/h3>\n\n\n\n<div class=\"wp-container-57 wp-block-columns\">\n<div class=\"wp-container-55 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/04-3.jpg\" alt=\"Flip chip bonder #1\" class=\"wp-image-835\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/04-3.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/04-3-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-56 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>Kan Electronics (MODEL6000)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum sample size<\/th><td>\u25a120 mm<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum generated force (load)<\/th><td>5 kgf (49 N)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum temperature<\/th><td>200 \u2103\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Chamber vacuum degree<\/th><td>Atmospheric pressure (N<sub>2<\/sub>&nbsp;gas flow possible)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum applied voltage<\/th><td>No voltage applied<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"equipment06-04\">Flip chip bonder#2(M-90-10)<\/h3>\n\n\n\n<div class=\"wp-container-60 wp-block-columns\">\n<div class=\"wp-container-58 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/07-2.jpg\" alt=\"Flip chip bonder#2(M-90-10)\" class=\"wp-image-838\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/07-2.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/07-2-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-59 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>HiSOL (M-90)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum sample size<\/th><td>Top: \u25a110 mm, bottom (Stage): 4 inch<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum generated force (load)<\/th><td> 5.5 N<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum temperature<\/th><td>350 \u2103<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Chamber vacuum<\/th><td>Atmospheric pressure<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum applied voltage<\/th><td>Voltage cannot be applied\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"equipment06-05\">EVG plasma activator<\/h3>\n\n\n\n<div class=\"wp-container-63 wp-block-columns\">\n<div class=\"wp-container-61 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/03-4.jpg\" alt=\"EVG plasma activator\" class=\"wp-image-841\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/03-4.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/03-4-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-62 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (manufacturer name) Model)<\/th><td>EV Group (EVG810)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum sample size<\/th><td>6 inch<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Chamber vacuum<\/th><td>About 1 Pa<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td>Applications for sample surface plasma treatment for low-temperature direct bonding\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"equipment06-06\">Megasonic Cleaner<\/h3>\n\n\n\n<div class=\"wp-container-66 wp-block-columns\">\n<div class=\"wp-container-64 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/02-3.jpg\" alt=\"Megasonic Cleaner\" class=\"wp-image-843\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/02-3.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/02-3-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-65 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model) <\/th><td>EV Group (EVG301)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum sample size<\/th><td>6 inch<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td>Applications for megasonic cleaning of the sample surface before treatment with the EVG plasma surface activation device, sample cleaning with a brush is possible\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"equipment06-07\">Laser dicer<\/h3>\n\n\n\n<div class=\"wp-container-69 wp-block-columns\">\n<div class=\"wp-container-67 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/09-5.jpg\" alt=\"Laser dicer\" class=\"wp-image-846\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/09-5.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/09-5-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-68 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name ( Model)<\/th><td>Self-made\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Features \/ Applications<\/th><td>Stealth dicing using laser\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Laser specifications (oscillator, wavelength, output, etc.)<\/th><td>Pulse fiber laser (manufactured by SPI Lasers, wavelength: 1064 nm, output: 12 W), pulse green laser (manufactured by Megaopto, wavelength: 532 nm, output: &gt; 1.2 W (1 kHz), &gt; 3.5 W (10 kHz))\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Processing Size<\/th><td>Maximum 25 \u00d7 25 mm\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Processing object<\/th><td>Silicon, Tempax, etc. (Consultation required)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td>A crack layer is formed inside the sample (Si, etc.). Chips cannot be made by laser dicing alone, and external bending stress is required.\n<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"equipment06-08\">Dicer<\/h3>\n\n\n\n<div class=\"wp-container-72 wp-block-columns\">\n<div class=\"wp-container-70 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/09-6.jpg\" alt=\"Dicer\" class=\"wp-image-848\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/09-6.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/09-6-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-71 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>DISCO (DAD3240)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Use<\/th><td>Cutting wafers (Si, glass, crystal, lithium niobate, etc.)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size<\/th><td>Maximum \u2300152.4 mm<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td>Must be pasted on dicing tape, etc.<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"equipment06-09\">Polishing machine(1PM52)<\/h3>\n\n\n\n<div class=\"wp-container-75 wp-block-columns\">\n<div class=\"wp-container-73 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/02-4.jpg\" alt=\"Polishing machine(1PM52)\" class=\"wp-image-853\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/02-4.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/02-4-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-74 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>Logistech (PM5)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Use<\/th><td>Polishing of wafers<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size<\/th><td>Maximum \u23004 inch<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td><\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"equipment06-10\">Grinding machine(NVG-200A)<\/h3>\n\n\n\n<div class=\"wp-container-78 wp-block-columns\">\n<div class=\"wp-container-76 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" width=\"480\" height=\"640\" src=\"\/mnc\/wp-content\/uploads\/2022\/02\/01-6.jpg\" alt=\"Grinding machine(NVG-200A)\" class=\"wp-image-858\" srcset=\"https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/01-6.jpg 480w, https:\/\/web.tohoku.ac.jp\/mnc\/wp-content\/uploads\/2022\/02\/01-6-353x470.jpg 353w\" sizes=\"(max-width: 480px) 100vw, 480px\" \/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-77 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>Nanofactor (NVG-200A)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Application<\/th><td>Grinding of samples<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Main specifications<\/th><td>Rotation speed: 100\u2013600 rpm, Machining accuracy: 10 <span class=\"unit_micro\">\u03bc<\/span>m<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size<\/th><td>100 mm, Height: 20 mm<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"main_no25\">Wafer Bonder (EVG540)<\/h3>\n\n\n\n<div class=\"wp-container-81 wp-block-columns\">\n<div class=\"wp-container-79 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><img src=\"\/mnc\/wp-content\/uploads\/floor_img\/evg540.jpg\" alt=\"Wafer Bonder (EVG540)\"\/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-80 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>EVG540<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Application<\/th><td>Wafer bonding<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size<\/th><td>8-inch or 12-inch wafers<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum generated force (load)<\/th><td>60000N<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum temperature<\/th><td>550\u2103<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Chamber vacuum degree<\/th><td>1E-06 mbar<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum applied voltage<\/th><td>3\u03c6200V\uff0c100A<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td>12-inch wafer \/ Maximal temperature at 550\u00b0C : 27.1kW<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"main_no26\">Wafer Aligner (EVG SmartView NT)<\/h3>\n\n\n\n<div class=\"wp-container-84 wp-block-columns\">\n<div class=\"wp-container-82 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><img src=\"\/mnc\/wp-content\/uploads\/floor_img\/evg-smartview-nt.jpg\" alt=\"Wafer Aligner (EVG SmartView NT)\"\/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-83 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>EVG SmartViewNT<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Application<\/th><td>Wafer aligner<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size<\/th><td>8-inch or 12-inch wafers<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum applied voltage<\/th><td>1\u03c6200V\uff0c16A<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td><\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"main_no27\">Plasma cleaner (AQ-500T)<\/h3>\n\n\n\n<div class=\"wp-container-87 wp-block-columns\">\n<div class=\"wp-container-85 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><img src=\"\/mnc\/wp-content\/uploads\/floor_img\/aq-500t.jpg\" alt=\"Plasma cleaner (AQ-500T)\"\/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-86 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>AQ-500T<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Application<\/th><td>Plasma activation<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size<\/th><td>Within 8 inches square<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Chamber vacuum degree<\/th><td>5Pa<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum applied voltage<\/th><td>Up to 300W<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td>Plasma source\nH<sub>2<\/sub>O\uff0cAr\uff0cO<sub>2<\/sub>\uff0cN<sub>2<\/sub><\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"main_no28\">Plasma cleaner (ONTOS)<\/h3>\n\n\n\n<div class=\"wp-container-90 wp-block-columns\">\n<div class=\"wp-container-88 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><img src=\"\/mnc\/wp-content\/uploads\/floor_img\/plasma-cleaner_ontos.jpg\" alt=\"Plasma cleaner (ONTOS)\"\/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-89 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>OntosTT Stand Alone Atmospheric Plasma Systems<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Application<\/th><td>Surface activation of semiconductor chips and wafers<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size<\/th><td>From 5mm square chips to 12-inch wafers.<br>\nSubstrate thickness up to 20mm.<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Chamber vacuum degree<\/th><td>Atmospheric pressure plasma<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum applied voltage<\/th><td>13.56MHz, up to 200W<br>\n(Input 1\u03c6 100V, 10A)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td>Plasma source\nAr\/H<sub>2<\/sub>\uff0895\/5\uff09\uff0cAr\uff0cO<sub>2<\/sub>\uff0cN<sub>2<\/sub><br>\nComputer-controlled moving X-Y-Z stage for plasma treatment of die or wafer<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"main_no29\">Flip chip bonder(FC3000W)<\/h3>\n\n\n\n<div class=\"wp-container-93 wp-block-columns\">\n<div class=\"wp-container-91 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><img src=\"\/mnc\/wp-content\/uploads\/floor_img\/fc3000w.jpg\" alt=\"Flip chip bonder(FC3000W)\"\/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-92 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>Toray Engineering Co.,Ltd.(FC3000W)<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Application<\/th><td>Flip-chip bonding<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size(tip)<\/th><td>Minimum: 3L \u00d7 3W<br>\nMaximum: 20L \u00d7 20W<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size(substrate)<\/th><td>8-inch, 12-inch wafer<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum generated force (load)<\/th><td>Ultra-low pressure head: 0.098 to 9.8N<br>\nThermal bonding head: 9.8 to 490N<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum temperature(head)<\/th><td>Room temp. to 450\u2103<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum temperature(constant stage)<\/th><td>Room temp. to 150\u2103<br>\n\uff0aMaximum heating area: 12-inch wafer<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Maximum temperature(pulse stage)<\/th><td>Room temp. to 400\u2103<br>\n\uff0aMaximum heating area: 20 mm\u25a1<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td><\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>\n\n\n\n<h3 id=\"main_no32\">Anodic bonding<\/h3>\n\n\n\n<div class=\"wp-container-96 wp-block-columns\">\n<div class=\"wp-container-94 wp-block-column\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><img src=\"\/mnc\/wp-content\/uploads\/floor_img\/anodic-bonding.jpg\" alt=\"Anodic bonding\"\/><\/figure><\/div><\/div>\n\n\n\n<div class=\"wp-container-95 wp-block-column\">\n<table>\n\t<tbody><tr>\n\t\t<th>Manufacturer name (model)<\/th><td>NEC<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Application<\/th><td>Anodic bonding<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Sample size<\/th><td>4inch<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Others<\/th><td>Wafer to wafer bonding<\/td>\n\t<\/tr>\n\t<tr>\n\t\t<th>Remarks<\/th><td><\/td>\n\t<\/tr>\n<\/tbody><\/table>\n<\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>table of contents Lithography\/exposure\/drawing equipment Film formation\/deposition Film processing\/etching Syn [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":12,"menu_order":16,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v20.0 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Bonding, polishing, packaging | Facilities | Tohoku University Smart System Super Integration Research Center<\/title>\n<meta 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